Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 25-30, 2021 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

Technical Program

Submit an Abstract
Abstract Submission Deadline: September 1, 2020

The 13th International Conference on the Technology of Plasticity (ICTP 2021) is dedicated to convening the breadth of the metal forming community to share their latest improvements and innovations in all aspects of metal forming science and technology. The heart of the ICTP conference series is the technical contributions from scientists and engineers across industry, academia, and government.

Keynote Speakers

Global Issues
Matthias Kleiner, Leibniz Association (Germany)
Presentation Title: Innovations Through Collaborative Research
Reimund Neugebauer, Fraunhofer-Gesellschaft (Germany)
Presentation Title: Forming the Future – Metal Forming, Innovation for Sustainability
Simulation
Pierre-Olivier Bouchard, Mines ParisTech (France)
Presentation Title: Numerical Modeling of Ductile Damage during Metal Forming: State of the Art and Future Challenges
 
Oana Cazacu, University of Florida-REEF (USA)
Presentation Title: Recent Advances on Modeling Plastic Deformation of Textured Metals with Applications to Metal Forming
Materials
Irene Beyerlein, University of California, Santa Barbara (USA)
Presentation Title: Using Plasticity for Making High-Performance Nanostructured Composites
 
Christopher Schuh, Massachusetts Institute of Technology (USA)
Presentation Title: The Fundamentals of Microparticle Impact Bonding in Metals, Alloys, and Advanced Materials
Innovation
Jun Chen, Shanghai Jiao Tong University, Shanghai (China)
Presentation Title: Recent Investigations on Incremental Sheet Forming: From Fundamentals to Industrial Application Technologies
 
Takashi Kuboki, University of Electro-Communications (Japan)
Presentation Title: Tube Forming and Fabricating Technologies for Contributing Society by Tackling Problems of Environment and Aging Population

Honorary Symposia

Below are several distinguished individual’s whose careers will be honored at this ICTP through symposia and other recognition in the programming. Please contact the key organizer listed below for additional details.

Proposed Honorary Symposia

Taylan Altan, The Ohio State University, (USA)
Key Organizer: Eren Billur, Billur Metal Form, (Turkey) eren@billur.com.tr

Betz Avitzur, Lehigh University, (USA)
Key Organizer: Wojciech Misiolek, Lehigh University (USA) wzm2@lehigh.edu

Niels Bay, Technical University of Denmark (Denmark)
Key Organizer: Paulo Martins, University of Lisbon (Portugal) pmartins@tecnico.ulisboa.pt

Xue Yu Ruan, Shanghai Jiao Tong University (China)
Key Organizer: Jun Chen, Shanghai Jiao Tong University (China) jun_chen@sjtu.edu.cn

Yasuhisa Tozawa, Nagoya University (Japan)
Key Organizers: Takashi Ishikawa, Chubu University (Japan) tak_ishikawa@isc.chubu.ac.jp
Yoshinori Yoshida, Gifu University (Japan) yyoshida@gifu-u.ac.jp

Rob Wagoner, The Ohio State University (USA)
Key Organizer: Hojun Lim, Sandia National Laboratories (USA) hnlim@sandia.gov

Zhongren Wang, Harbin Institute of Technology (China)
Key Organizers: Shijian Yuan, Harbin Institute of Technology (China) syuan@hit.edu.cn
Gang Liu, Harbin Institute of Technology (China) gliu@hit.edu.cn

ICTP 2021 Awards

Abstract Submissions

The 13th International Conference on the Technology of Plasticity was originally planned for July 2020 and is now set for July 2021, due to the global impact of COVID-19. A call for abstracts has reopened for the 2021 event. Abstracts must be submitted to ProgramMaster by September 1, 2020 to be considered for inclusion in the conference.

If you have any questions regarding abstract submission, send an e-mail to TMS Programming Staff.

Join Our E-mail List

Be the first to know about important updates to ICTP, including registration opening, housing details, and programming details. Click the button below and complete the short form if you are interested in receiving e-mail updates from TMS.

Sign Up for Updates

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone:
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770