Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 26-31, 2020 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

Technical Program

Submit an Abstract
Extended Abstract Submission Deadline: August 31, 2019

The 13th International Conference on the Technology of Plasticity (ICTP 2020) is dedicated to convening the breadth of the metal forming community to share their latest improvements and innovations in all aspects of metal forming science and technology. The heart of the ICTP conference series are the technical contributions. Abstracts are accepted in all areas related to the plastic deformation of materials to create components. Of particular interest are the following topics:

  • Metal Forming Processes & Equipment
    Original work on new methods, analyses or simulation of metal forming processes is welcome. All processes are of interest including: bending, cold forging, extrusion, friction-stir processing, hot forging, lubrication and assessment for hot and cold operations, open and closed-die forging, rolling (including ring, shape and other rolling variants), shearing, sheet metal forming and stamping, and superplastic forming.
  • Joining by Forming and Deformation
    As advanced materials challenge our ability to join them by traditional methods (such as welding), joining by deformation by mechanical interlocking or metallurgical joining becomes more attractive. Novel work on joining that does not involve melting or fasteners is welcome.
  • Microstructure and Damage Development & Characterization
    Metal forming changes the material microstructure. This can have strikingly positive effects in refining or orienting the crystalline microstructure and inducing beneficial residual stresses. Also, damage, in the form of voids or possibly other features, is possible. Work on microstructural development and characterization is welcome. Of particular interest is work that optimizes microstructure locally to optimize component performance.
  • Big Data and Metal Forming
    We now routinely have access to enormous amounts of data from customers, in-process measurements, characterization of materials and components, as well as from other sources. This provides great challenges and opportunities to metal forming. This session will consider topics related to where big data and artificial intelligence meet metal forming.
  • High Speed and Impulse Forming
    Impulse-based processes can access phenomena, such as very high pressures and strain rates, which are inaccessible with quasi-static processes. Work on the demonstration, analysis or innovation of these processes for welding, joining, forming or calibration are welcome.
  • Agile Metal Forming
    While processing by plastic deformation may be one of the most sustainable means of production, the time period between design and production is usually quite long, because large dies must be fabricated and installed in presses. Means for rapid production will be emphasized including incremental forming, simulation to reduce time to production and means of more rapidly producing tooling.
  • Microstructure development by forming
    The first-order role of forming is to create a useful shape. Components become truly useful if materials properties are also optimized. Design and process are essential in this realization. Methods of microstructural design and optimization including tailoring microstructure to applications and processes to optimize microstructure (such as severe plastic deformation) are welcome.
  • Technologies to Speed Innovation
    Metal forming holds a special place in technology. While formed metal parts are key enablers of critical transportation, medical and energy equipment, the area does not have the same kinds of Moore’s law technological innovation as seen in computing, electronics or genetic biology. There is, however, a great pressure to reduce the time between design and production. The enablers of speeding time from design to assured production will be considered, including simulations, novel die making, new forming technologies and new strategies for validation and verification.
  • Value of, and Limits to, Simulation
    Simulation is at the core of modern metal forming. It has allowed the rapid design of processes with optimal shape and properties in components. Simulating metal forming however, remains difficult. Aspects of metal structure, constitutive laws, and boundary conditions (including lubrication) all make robust simulations that mimic reality difficult. The past, current, and future of simulation will be assessed.

Honorary Symposia

Below are several distinguished individual’s whose careers will be honored at this ICTP through symposia and other recognition in the programming. Please contact the key organizer listed below for additional details.

Proposed Honorary Symposia

Taylan Altan, The Ohio State University, (USA)
Key Organizer: Eren Billur, Billur Metal Form, (Turkey) eren@billur.com.tr

Betz Avitzur, Lehigh University, (USA)
Key Organizer: Wojciech Misiolek, Lehigh University (USA) wzm2@lehigh.edu

Niels Bay, Technical University of Denmark (Denmark)
Key Organizer: Paulo Martins, University of Lisbon (Portugal) pmartins@tecnico.ulisboa.pt

Xue Yu Ruan, Shanghai Jiao Tong University (China)
Key Organizer: Jun Chen, Shanghai Jiao Tong University (China) jun_chen@sjtu.edu.cn

Yasuhisa Tozawa, Nagoya University (Japan)
Key Organizers: Takashi Ishikawa, Chubu University (Japan) tak_ishikawa@isc.chubu.ac.jp
Yoshinori Yoshida, Gifu University (Japan) yyoshida@gifu-u.ac.jp

Rob Wagoner, The Ohio State University (USA)
Key Organizer: Hojun Lim, Sandia National Laboratories (USA) hnlim@sandia.gov

Zhongren Wang, Harbin Institute of Technology (China)
Key Organizers: Shijian Yuan, Harbin Institute of Technology (China) syuan@hit.edu.cn
Gang Liu, Harbin Institute of Technology (China) gliu@hit.edu.cn

Keynote Speakers

Global Issues: Reimund Neugebauer, Fraunhofer-Gesellschaft (Germany)
Presentation Title: Forming the Future – Metal Forming, Innovation for Sustainability
 
Simulation: Pierre-Olivier Bouchard, Mines ParisTech (France)
Presentation Title: Numerical Modeling of Ductile Damage during Metal Forming: State of the Art and Future Challenges

Oana Cazacu, University of Florida-REEF (USA)
Presentation Title: Recent Advances on Modeling Plastic Deformation of Textured Metals with Applications to Metal Forming
 
Materials: Irene Beyerlein, University of California, Santa Barbara (USA)
Christopher Schuh, Massachusetts Institute of Technology (USA)
 
Innovation: Jun Chen, Shanghai Jiao Tong University, Shanghai (China)
Presentation Title: Recent Investigations on Incremental Sheet Forming: From Fundamentals to Industrial Application Technologies

Takashi Kuboki, University of Electro-Communications (Japan)
Presentation Title: Tube Forming and Fabricating Technologies for Contributing Society by Tackling Problems of Environment and Aging Population
 

ICTP Award

Japan Society for Technology of Plasticity (JSTP) ICTP Award for Young Researchers

Learn more about the award and apply using this form at this link.

Abstract Submissions

Abstracts must be submitted to ProgramMaster by the extended deadline of August 31, 2019, to be considered for inclusion in the conference.

To assist the conference organizing committee in evaluating abstracts fairly, please be as clear and detailed in your abstract as possible. Abstracts should be 150 words.

If you have any questions regarding abstract submission, send an e-mail to TMS Programming Staff.

International Conferences on the Technology of Plasticity (ICTP):

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