Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 26-31, 2020 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

Technical Program

The 13th International Conference on the Technology of Plasticity (ICTP 2020) is dedicated to convening the breadth of the metal forming community to share their latest improvements and innovations in all aspects of metal forming science and technology. The heart of the ICTP conference series are the technical contributions.

Keynote Speakers

Global Issues
Matthias Kleiner, Leibniz Association (Germany)
Reimund Neugebauer, Fraunhofer-Gesellschaft (Germany)
Presentation Title: Forming the Future – Metal Forming, Innovation for Sustainability
Simulation
Pierre-Olivier Bouchard, Mines ParisTech (France)
Presentation Title: Numerical Modeling of Ductile Damage during Metal Forming: State of the Art and Future Challenges
 
Oana Cazacu, University of Florida-REEF (USA)
Presentation Title: Recent Advances on Modeling Plastic Deformation of Textured Metals with Applications to Metal Forming
Materials
Irene Beyerlein, University of California, Santa Barbara (USA)
Presentation Title: Using Plasticity for Making High-Performance Nanostructured Composites
 
Christopher Schuh, Massachusetts Institute of Technology (USA)
Innovation
Jun Chen, Shanghai Jiao Tong University, Shanghai (China)
Presentation Title: Recent Investigations on Incremental Sheet Forming: From Fundamentals to Industrial Application Technologies
 
Takashi Kuboki, University of Electro-Communications (Japan)
Presentation Title: Tube Forming and Fabricating Technologies for Contributing Society by Tackling Problems of Environment and Aging Population

Honorary Symposia

Below are several distinguished individual’s whose careers will be honored at this ICTP through symposia and other recognition in the programming. Please contact the key organizer listed below for additional details.

Proposed Honorary Symposia

Taylan Altan, The Ohio State University, (USA)
Key Organizer: Eren Billur, Billur Metal Form, (Turkey) eren@billur.com.tr

Betz Avitzur, Lehigh University, (USA)
Key Organizer: Wojciech Misiolek, Lehigh University (USA) wzm2@lehigh.edu

Niels Bay, Technical University of Denmark (Denmark)
Key Organizer: Paulo Martins, University of Lisbon (Portugal) pmartins@tecnico.ulisboa.pt

Xue Yu Ruan, Shanghai Jiao Tong University (China)
Key Organizer: Jun Chen, Shanghai Jiao Tong University (China) jun_chen@sjtu.edu.cn

Yasuhisa Tozawa, Nagoya University (Japan)
Key Organizers: Takashi Ishikawa, Chubu University (Japan) tak_ishikawa@isc.chubu.ac.jp
Yoshinori Yoshida, Gifu University (Japan) yyoshida@gifu-u.ac.jp

Rob Wagoner, The Ohio State University (USA)
Key Organizer: Hojun Lim, Sandia National Laboratories (USA) hnlim@sandia.gov

Zhongren Wang, Harbin Institute of Technology (China)
Key Organizers: Shijian Yuan, Harbin Institute of Technology (China) syuan@hit.edu.cn
Gang Liu, Harbin Institute of Technology (China) gliu@hit.edu.cn

ICTP Awards

  • Japan Society for Technology of Plasticity (JSTP) International Prize for Research & Development in Precision Forging
    Learn more about the JSTP research & development award and apply using the form at this link.
  • Japan Society for Technology of Plasticity ICTP Award for Young Researchers
    Learn more about the JSTP young researchers award and apply using the form at this link.

Abstract Submissions

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