Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 25-30, 2021 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

Committee Members

ICTP 2021 International Scientific Committee

Tatsuhiko Aizawa, Shibaura Institute of Technology (Japan)
Julian Allwood, University of Cambridge (UK)
Birgit Awiszus, TU Chemnitz (Germany)
Tudor Balan, Arts et Métiers ParisTech (France)
Markus Bambach, BTU Cottbus-Senftenberg (Germany)
Dorel Banabic, Technical University of Cluj-Napoca (Romania)
Francois Bay, Mines ParisTech (France)
Niels Bay, Technical University of Denmark (Denmark)
Bernd-Arno Behrens, Leibniz Universitat Hannover (Germany)
Yan Beygelzimer, Donetsk Institute for Physics and Engineering National Academy of Sciences of Ukraine (Ukraine)
Regis Bigot, Ecole Nationale Supérieure d'Arts et Métiers (France)
Pierre-Olivier Bouchard, Mines ParisTech (France)
Jose Divo Bressan, Universidade do Estado de Santa Catarina (Brazil)
Alexander Brosius, Technische Universität Dresden (Germany)
Stefania Bruschi, University of Padova (Italy)
Sergio Button, State University of Campinas (Brazil)
Demircan Canadinc, Koç University (Turkey)
Jian Cao, Northwestern University (USA)
Jianguo Cao, University of Science and Technology Beijing (China)
Oana Cazacu, University of Florida (USA)
Elisabetta Ceretti, University of Brescia (Italy)
Jose Cesar de Sa, University of Porto (Portugal)
Paulo Roberto Cetlin, Federal University of Minas Gerais (Brazil)
Yvan Chastel, Renault (France)
Francisco Chinesta, Arts et Métiers ParisTech (France)
Laszlo Cser, Corvinus University of Budapest (Hungary)
Elías Cueto, University of Zaragoza (Spain)
Zhenshan Cui, Shanghai Jiao Tong University (China)
Glenn Daehn, The Ohio State University (USA)
Prashant P. Date, Indian Institute of Technology Bombay (India)
Joost Duflou, KU Leuven (Belgium)
Gang (G) Fang, Tsinghua University (China)
Luigino Filice, University of Calabria (Italy)
Livan Fratini, Università degli Studi di Palermo (Italy)
Lander Galdos, Mondragon Unibertsitatea (Spain)
Andrea Ghiotti, University of Padova (Italy)
Sergey Golovashchenko, Oakland University (USA)
Zbigniew Gronostajski, Wroclaw University of Technology (Poland)
Gerhard Hirt, RWTH Aachen (Germany)
Werner Homberg, Paderborn University (Germany)
Sung-Tae Hong, University of Ulsan (Korea)
Odd Sture Hopperstad, Norwegian University of Science and Technology (Norway)
Yujie Huang, Huazhong University of Science and Technology (U.K.)
Hoon Huh, Korea Advanced Institute of Science and Technology (Korea)
Y.T. Im, Korea Advanced Institute of Science and Technology (Korea)
Shohei Kajikawa, The University of Electro-Communications (Japan)
Celalettin Karadogan, Universität Stuttgart (Germany)
Hyunok Kim, EWI (USA)
Brad Kinsey, University of New Hampshire (USA)
Antti Korhonen, Helsinki University of Technology (Finland)
Toshihiko Kuwabara, Tokyo University of Agriculture and Technology (Japan)
Da Yong (D-Y) Li, Shanghai Jiaotong University (China)
Jian-Jun (J-J) Li, Huazhong University of Science and Technology (China)
Mathias Liewald, Universität Stuttgart (Germany)
Lars-Erik Lindgren, Luleå University of Technology (Sweden)
Gang Liu, Harbin Institute of Technology (China)
Hui Long, The University of Sheffield (UK)
Evripides Loukaides, Bath University (UK)
Lukasz Madej, AGH University (Poland)
Ryo Matsumoto, Osaka University (Japan)
Takashi Matsuno, Tottori University (Japan)
Marion Merklein, Universität Erlangen-Nürnberg (Germany)
Wojciech Misiolek, Lehigh University (USA)
Pierre Montmitonnet, CEMEF - Centre de Mise en Forme des Matériaux (France)
Y.H. Moon, Pusan National University (Korea)
Ken-ichiro Mori, Toyohashi University of Technology (Japan)
Omer Music, TED University (Turkey)
Thomas Neitzert, Auckland University of Technology (New Zealand)
Gracious Ngaile, North Carolina State University (USA)
Takeshi Nishiwaki, Daido University (Japan)
Takahiro Ohashi, Kokushikan University (Japan)
Mats Oldenburg, Luleå University of Technology (Sweden)
Masaaki Otsu, University of Fukui (Japan)
Hengan Ou, University of Nottingham (UK)
Aleksandr Pesin, Magnitogorsk State Technical University (Russia)
Jean-Philippe Ponthot, University of Liege (Belgium)
Warren Poole, The University of British Columbia (Canada)
Alexandre Rocha da Silva, Federal University of Rio Grande do Sul (Brazil)
Andrzej Rosochowski, University of Strathclyde Glasgow (UK)
Jinn-Jong Sheu, National Kaohsiung University of Science and Technology (China)
Kazunari Shinagawa, Kyushu University (Japan)
Andreas Sterzing, Fraunhofer IWU (Germany)
Erman Tekkaya, Technische Universität Dortmund (Germany)
Miklós Tisza, University of Miskolc (Hungary)
Hiroshi Utsunomiya, Osaka University (Japan)
Ton van den Boogaard, University of Twente (Netherlands)
Anupam Vivek, The Ohio State University (USA)
Frank Vollertsen, Bremer Institut für angewandte Strahltechnik GmbH (Germany)
Robert Wagoner, The Ohio State University (USA)
Zhigang Wang, Gifu University (Japan)
Michael Worswick, University of Waterloo (Canada)
Jian-Xin (J-X) Xie, University of Science and Technology Beijing (China)
Dong-Yol Yang, Gwangju Institute of Science and Technology (Korea)
Yoshinori Yoshida, Gifu University (Japan)
Hai Liang (H-L) Yu, Central South University (China)
Mei (M) Zhan, Northwestern Polytech University (China)
Shihong (S-H) Zhang, Institute of Metal Research, Chinese Academy of Sciences (China)
Guo-Qun Zhao (G-Q) Zhao, Shandong University (China)
Zhen Zhao, Shanghai Jiaotong University (China)

ICTP Standing Advisory Board

Hiroshi Utsunomiya, Osaka University (Japan)
Pierre-Olivier Bouchard, Mines ParisTech (France)
Julian Allwood, University of Cambridge (UK)
Paolo Bariani, University of Padova (Italy)
Jian Cao, Northwestern University (USA)
Yvan Chastel, Renault (France)
Glenn Daehn, The Ohio State University (USA)
Gerhard Hirt, RWTH Aachen University (Germany)
Peter Groche, TU Darmstadt (Germany)
Hoon Huh, KAIST (S. Korea)
Tak Ishikawa, ISC CHUBU (Japan)
Chung Gil Kang, Pusan National University (Korea)
Manabu Kiuchi, Teikyo Heisei University (Japan)
Jianjun Li, Huazhong University (China)
Martins Paulo, New University of Lisbon (Portugal)
Marion Merklein, Lehrstuhl fur Fertigungstechnologie (Germany)
Ken-Ichiro Mori, Toyohashi University of Technology (Japan)
Rajiv Shivpuri, The Ohio State University (USA)
Erman Tekkaya, Institute für Umformtechnik und Leichtbau (Germany)
Yuan Shijian, Harbin Institute of Technology (China)
Jun Yanagimoto, University of Tokyo (Japan)

For More Information

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