Topic Title: Advances in Electronic Interconnection Materials
Manuscript Submission Deadline:
July 01, 2018
Sponsored By: Electronic Packaging and Interconnection Materials Committee
Publication Date: December 2018
Keywords: Electronic Materials,Intermetallics,Lead, Zinc, and Tin
Scope: This topic will include papers on Pb-free solder development, advances in the understanding of joint reliability and emerging interconnection materials for harsh environments.
Call for Papers