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JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

Manuscript Submission Deadline: April 01, 2019

Lead Organizer: Shih-Kang Lin

Sponsored By: Alloy Phases Committee

Publication Date: September 2019

Keywords: Advanced processing, alloy phases, electronic materials, joining, phase transformations

Scope: Papers are invited for this special topic covering recent advances of bonding technologies for 2.5D and 3D IC, wide-band-gap (WBG) semiconductors, and flexible electronics.

Call for Papers:

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JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

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