JOM Editorial Calendar - Topic Details

Advanced Interconnect and Packaging Technologies

Manuscript Submission Deadline: December 01, 2024
Guest Editor: Fan-Yi Ouyang
Co-Guest Editor:
Publication Date: June 2025
Keywords: Advanced Materials, Electronic Materials, Intermetallics, Joining, Thin Films and Interfaces, Reliability
Scope: Advanced progress in microelectronic, optoelectronic, and nano-electronic devices requires developing new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance, and environmental demands placed on interconnects and packaging at all levels. The special topic will address current research in new and existing materials for advanced interconnect and packaging technologies, including Pb-free and low-temperature solder alloys, Ag and Cu sintering, hybrid bonding, 3D packaging and interconnection, wafer-level packaging, and reliability issues.
Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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