JOM Editorial Calendar - Topic Details

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Manuscript Submission Deadline: November 01, 2024

Guest Editor: Peter Hosemann

Co-Guest Editors: Daniel Kiener

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Sponsored By: Nanomechanical Materials Behavior, Electronic Packaging and Interconnection Materials

Publication Date: May 2025

Keywords: Electronic Materials, Mechanical Properties, Surface Modification and Coatings, Synthesis and Processing, Thin Films and Interfaces

Scope: Electronic devices found in consumer electronics, high performance computing, or power electronics are enabled by material science advances. In order to further advance computing power, new challenges in packaging, chiplet design, and power delivery need to be addressed. Thermal and mechanical properties in the chip ecosystem are key elements that must be understood and characterized. Nanomechanical testing and characterization are needed to ensure reliable performance of these systems. We invite papers featuring mechanical as well as combined tests (thermal-mechanical, electrical-mechanical, etc.) and evaluations of materials and composites relevant for electronic applications.

Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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