JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

Access all papers from this issue here.

This topic is no longer accepting submissions.

Guest Editor: Shih-Kang Lin
Co-Guest Editor:
Sponsored By: Alloy Phases
Publication Date: September 2019
Keywords: Advanced processing, alloy phases, electronic materials, joining, phase transformations
Scope: Papers are invited for this special topic covering recent advances of bonding technologies for 2.5D and 3D IC, wide-band-gap (WBG) semiconductors, and flexible electronics.