JOM Editorial Calendar - Topic Details

Progress with Lead-Free Solders

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Guest Editor: Chris Gourlay
Co-Guest Editors: Babak Arfaei
Publication Date: February 2020
Scope: Pb-free solders are now in widespread use and can out-perform Pb-based materials in many applications. Despite this success, there is an ongoing need to develop next-generation interconnection materials for smaller joints that can operate in more extreme environments and that are more reliable. This topic covers recent advances in solder alloy design for harsh environments, new interconnection materials and bonding technologies, and advances in the understanding of electronics reliability.