Interfacial Stability in Multi-component Systems
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Co-Guest Editors: Shih-Kang Lin
Publication Date: October 2020
Keywords: Alloy Phases, Electronic Materials
Scope: Papers are invited for this special topic covering interfacial bonding, interfacial stability, reaction kinetics, phase formation and characterization, and complex interfacial phenomena in various applied fields, including advanced microelectronics packaging, semiconductor systems, thermoelectric modules, energy materials and other related interfacial systems.