Volume 23, Number 7, July 1994

This Month Featuring: Special Issue on the Metallurgy of the Less Common Metals and the Emerging New Applications, Regular Issue Papers, and Insert.


Foreword [p. 581]
H.D. Merchant, T.D. Schlabach, and F.G. Yost

Intermetallic Compound Layer Formation Between Copper and Hot-Dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb Coatings [pp. 583-594]
Paul T. Vianco, Paul F. Hlava, and Alice C. Kilgo

A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu [pp. 595-602]
Chad M. Miller, Iver E. Anderson, and Jack F. Smith

On the Sn-Bi-Ag Ternary Phase Diagram [pp. 603-610]
Ursula R. Kattner and William J. Boettinger

The Effect of Aging on Microstructure, Room Temperature Deformation, and Fracture of Sn-Bi/Cu Solder Joints [pp. 611-618]
C.H. Raeder, L.E. Felton, V.A. Tanzi, and D.B. Knorr

An Investigation of Phase Equilibria of the Bi-Sb-Sn System [pp. 619-624]
G. Ghosh, M. Loomans, and M.E. Fine

In-Situ Process for AlGaAs Compound Semiconductor: Materials Science and Device Fabrication [pp. 625-634]
M. Hong, K.D. Choquette, J.P. Mannaerts, L.H. Grober, R.S. Freund, D. Vakhshoori, S.N.G. Chu, H.S. Luptman, and R.C. Wetzel

New, Lead-Free Solders [pp. 635-640]
M. McCormack and S. Jin


Resilient Metal Spring Network Silicone-Matrix Composite for Separable Interconnections [pp. 641-648]
Mingguang Zhu and D.D.L. Chung

Compositional Inhomogeneity at the Epitaxial Layer and Substrate Interface of AlGaAs/GaAs Heterostructures [pp. 649-652]
Cynthia M. Hanson, Ricardo Basco, Farid Agahi, Kei May Lau, R.T. Lareau, and T.P. Monahan

Thermally Stable Poled Polymers: Highly Efficient Heteroaromatic Chromophores in High Temperature Polymides [pp. 653-658]
Alex K.-Y. Jen, K.Y. Wong, V. Pushkara Rao, K. Drost, and Y.M. Cai

Alkoxide Precursors for Controlled Oxygen Incorporation during Metalorganic Vapor Phase Epitaxy GaAs and AlxGa1-xAs Growth [pp. 659-668]
J.W. Huang, D.F. Gaines, T.F. Kuech, R.M. Potemski and F. Cardone

Temperature Dependence of Minority Hole Mobility in n+-GaAs Measured with a New Variable Temperature Technique [pp. 669-674]
Michael L. Lovejoy, Michael R. Melloch, Mark S. Lundstrom, Brian R. Keyes, and Richard K Ahrenkiel

High Uniformity of Al0.3Ga0.7As/In0.15,Ga0.85As Doped-Channel Structures Grown by Molecular Beam Epitaxy on 3" GaAs Substrates [pp. 675-680]
Yi-Jen Chan, Ming-Ta Yang, Tzu-Jin Yeh, and Jen-Inn Chyi

An Investigation of Photocurrent Loss due to Reflectance and Absorption in CdTe/CdS Heterodunction Solar Cells [pp. 681-686]
H.C. Chou, A.K. Bhat, S. Kamra, and A. Rohatgi


New Lead-Free, Sn-Zn-In Solder Alloys [pp. 687-690]
M. McCormack, S. Jin, H.S. Chen, and D.A. Machusak


1994 Electronic Materials Conference Program

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