|
|
TMS 2009:
Lead-Free Solders Workshop
Date: Sunday, February 15
This workshop is organized to serve as the industry roadmap for Pb free solders in high reliability packaging and interconnections, with current industry needs and concerns serving as a driving force for research. Through presentations and extensive discussion regarding key topics, this workshop will provide a bridge between companies producing high reliability products and research groups in academia, national laboratories and consortia and will lead to the materials science fundamentals necessary for further understanding and future industry applications.
|
|
|
Attendees will learn about:
- High reliability in the telecommunication industry
- Reliability in the automobile industry and in consumer electronics
- Pb-free solder creep and mechanical property fundamentals
- Stress-strain behavior of Pb-free solders over a wide range of strain rates
- Pb-free board assembly related issues and solutions
- Sn whisker fundamentals and reliability
- Sn grain orientation effects on long-term reliability
- Future directions in new solder alloy compositions
Panel Discussion Participants
- Iver Anderson, Ames Laboratory
- Srinivas Chada, Medtronics
- Carol Handwerker, Purdue University
- Fay Hua, Intel
- Sung-Kwon Kang, IBM
- C. Robert Kao, National Taiwan University
- Tae-Kyu Lee, Cisco
Invited Speakers
- Thomas Bieler, Michigan State University
- Weinong Wayne Chen, Purdue University
- Darrel Frear, Freescale
- Vivek Gupta, Freescale
- Greg Henshall, HP
- J.W. Morris Jr., University of California, Berkeley
- John Osenbach, LSI
- Polina Snugovsky, Celestica
- Ganesh Subbarayan, Purdue University
- Dave Towne, Cisco
How to Register for this Course
Register by January 16, 2009 using the
online registration form or download
the Registration Form (PDF) and mail or fax with your payment.
The cost for this course is $0 for meeting attendees / $50 for
others.
For more information about this workshop from the organizer, visit
www.solderworkshop.com.
|
|
|