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2001 Electronic Materials Conference: Student Information

June 27-29, 2001 · 43RD ELECTRONIC MATERIALS CONFERENCE · Notre Dame, Indiana

EMC LogoThe 43rd Electronic Materials Conference (EMC) sponsored by the Electronic Materials Committee of TMS will be held at the University of Notre Dame, Notre Dame, Indiana, from Wednesday, June 27 through Friday, June 29, 2001. The conference provides a forum for topics of current interest and significance on the area of preparation and characterization of electronic materials. Individuals actively engaged or interested in electronic materials research and development are encouraged to attend this meeting, and papers in this general subject area are solicited.

The EMC is again being coordinated with the Device Research Conference (DRC) of IEEE, which will be held at the same location, Monday, June 25 through Wednesday, June 27, 2001. This coordination is made in recognition of the strong interaction between electronic materials and device research and should provide for maximum exchange of information between attendees of both conferences.


Three to five $500 student awards are given annually by the Electronic Materials Committee for the best presentations by students at the conference. Student papers are judged on both scientific content and presentation at the Electronic Materials Conference.

Awards will be presented to the 2000 student winners during the plenary session on Wednesday, June 27, in Washington Hall.


Student:    Sujit Banerjee
Professor:    T.P. Chow
Title:    “Effect of Implant Annea and Oxidation Conditions on Nitrogen and Phosphorus Implanted 4H-SiC”

Student:    Thomas Langdo
Professor:    Eugene Fitzgerald
Title:   “Facet-Free Raised/Source Drain Contacts for Dual-Gate MOSFETs by Selective Epitaxy”

Student:    Chris Leitz
Professor:    Eugene Fitzgerald
Title:   “Dislocation Guide, Blocking, and Reduction Kinetics in Compositionally Graded SiGe/Si”

Student:    Farid A. Khan
Professor:    Ilesanmi Adesida
Title:   “Etching of Silicon Carbide for Device Fabrication and Via-Hole Formation”


Student authors who plan to present a paper at the 2001 Electronic Materials Conference may be eligible for travel assistance depending on the particular circumstances involved. To apply for student travel assistance, submit an application no later than June 4, 2001 to:

Michael R. Melloch, General Chairman
Purdue University
School of Electrical and Computer Engineering
1285 Electrical Engineering Building
West Lafayette, IN 47907-1285
Telephone: 765-494-3528
Fax: 765-494-6441

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