59th Annual Device Research Conference

59th ANNUAL DEVICE RESEARCH CONFERENCE
June 25–27, 2001 · University of Notre Dame, Notre Dame, Indiana

The DRC brings together scientists, engineers, and students to discuss new and exciting breakthroughs and advances in the field of device research. The DRC is sponsored by the IEEE Electron Devices Society. The conference will be held at University of Notre Dame, Notre Dame, Indiana, from Monday, June 25 through Wednesday, June 27.

A special session will be dedicated to new materials, novel devices, and emerging technologies. Invited speakers will present the latest developments in promising new devices and device technologies. A special poster session will be presented on exploratory device concepts and novel device technologies.

The Device Research technical program will com-mence at 8:30 AM on Monday, June 25. All sessions will be held on grounds at the University of Notre Dame in DeBartolo Hall. The Plenary Session will be located in Room 101, DeBartolo Hall.

EMC/DRC

The DRC and the Electronic Materials Conference (EMC) of TMS will again coordinate activities. The EMC will be held at the same location on Wednesday, June 27 through Friday, June 29, 2001. Device-oriented papers should be submitted to the DRC and materials-oriented papers to the EMC.

An On-line View of
The 2001 DEVICE RESEARCH CONFERENCE

VIEW THE ATTENDEES LIST (Downloadable using Adobe Acrobat)

REGISTRATION INFORMATION
The deadline to preregister for the meeting has passed. It is now necessary to register at the meeting site during conference.

TRAVEL INFORMATION
PDF FILES FOR DOWNLOAD
Adobe Acrobat is requried for viewing of all PDF files listed below.
Advance Program (~543 kb) On-Campus Housing Registration Form (~71 kb) Maps of Notre Dame and South Bend (~588 kb) Final Technical Program (~120 kb)

TECHNICAL PROGRAM COMMITTEE
Anant K. Agarwal, CREE; Tayo Akinwande, Massachusetts Inst. of Technology; Pallab Bhattacharya, University of Michigan; Colombo R. Bolognesi, Simon Fraser University; Kent D. Choquette, University of Illinois, Urbana; Jack M. Hergenrother, Agere Systems; Erhard Kohn, University of Ulm; Richard A. Kiehl, University of Minnesota; Hagen Klauk, Infineon Technologies; Theresa Mayer, Pennsylvania State University; Yasuyuki Miyamoto, Tokyo Institute of Technology; Shuji Nakamura, Univ. of California, Santa Barbara; Edward Nowak, IBM; Daniel J. Radack, Defense Adv. Res. Projects Agcy.; Leonard Franklin Register, The University of Texas at Austin; Olav Solgaard, Stanford University; Vivek Subramanian, University of Berkeley; Yasuo Takahashi, NTT Basic Research Labs; Jeffrey Welser, IBM Microelectronics Division
General Program Chair Mark Rodwell University of California Dept. of Electrical & Computer Engrg. Santa Barbara, CA 93106 Tel: (805) 893-3244 Fax: (805) 893-3262 Email: rodwell@ece.ucsb.edu Web: http://penine.ece.ucsb.edu/ Area of expertise: III-V transistors Local Arrangements Chair Alan Seabaugh University of Notre Dame Dept. of Electrical Enineering 266 Fitzpatrick Hall Notre Dame, IN 46556 Tel: (219) 631-4473 Fax: (219) 631-4393 Email: seabaugh.1@nd.edu Overseas Chair Erhard Kohn, U. of Ulm	Technical Program Chair Sanjay Banerjee Fedex Mailing Address: 10100 Burnet Rd., Bldg. 160 MER 1.606B/R9900 Austin, TX 78758 U.S. Mailing Address: MER 1.606B/R9900 University of Texas Austin, TX 78712 Tel: (512) 471-6730 Fax: (512) 471-8420 Email: banerjee@ece.utexas.edu j.toll@mail.utexas.edu (Jean Toll, Assistant) Web: http://www.ece.utexas.edu/projects/ece/mrc/ Area of expertise: Silicon-germanium device Treasurer Tom Jackson, Pennsylvania State University Past Chairman Mark Rodder, Texas Instruments

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