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2003 Electronic Materials Conference: Conference Proceedings

June 25-27, 2003 · 45TH ELECTRONIC MATERIALS CONFERENCE · Salt Lake City, Utah

 
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PUBLICATION INFORMATION

There are no formal conference proceedings, but the conference abstracts will be published in the Journal of Electronic Materials (JEM). JEM encourages both presenters and attendees to submit manuscripts on their work.

JEM, a monthly archival publication of TMS and the Institute of Electrical and Electronics Engineers (IEEE), was created to serve as the publication of the Electronic Materials Conference. Throughout the year, JEM publishes selected papers presented at the Electronic Materials Conference and welcomes the submission of related electronic materials articles.

The journal contains technical papers detailing critical new developments in the electronics field, as well as invited and contributed review papers on topics of current interest, designed to enable those in the field of electronics to keep abreast of activities in areas vital to their own technical interests.

Articles that appear in JEM are reviewed, selected, and edited by peers in the field who serve as voluntary members of the editorial board or the board of associate editors or as section editors. Generally, they are members of the Electronic Materials Committee of TMS or are members of IEEE.

The full conference member $382, USA Nonmember $542 and Non-USA Nonmember $562 registration fees include a subscription to the 2004Journal of Electronic Materials which will include manuscripts of papers presented at the 2003 Electronic Materials Conference. Those who register for one day may order a subscription to the 2004 JEM on the registration form or by contacting TMS.

JEM SUBSCRIPTION INFORMATION

The Journal of Electronic Materials acts as a forum for the rapid circulation of the results of original research, enabling those in the electronic materials field to keep abreast of activities peripheral to their own. The journal focuses on electronic memory and logic structures, magnetic-optical recording media, superlattices, packaging, detectors, emitters, metallization technology, superconductors, and low thermal-budget processing and includes general papers on electronic materials for device application, structure making, reliability, and yield. Articles on methods for preparing and evaluating the chemical, physical, and electronic properties of electronic materials are also included.

JEM subscriptions are available in both print and electronic formats. In addition to receiving on-line access to the current issues of the journal, electronic subscribers have unlimited access to past journal issues with their subscription.

TMS and IEEE members receive signifi cant discounts on JEM subscriptions. Full conference registration includes a subscription to JEM for 2004. Those who register for one day should contact TMS to subscribe.

Individual issues of the journal may also be purchased through the TMS Document Center for $25 a copy, plus shipping, or through TMS at the following:

Mark Cirelli
TMS Subscriptions
184 Thorn Hill Road
Warrendale, PA 15086
Telephone: 724-776-9000, ext. 251
Fax: 724-776-3770
E-mail: subscriptions@tms.org

MANUSCRIPT SUBMISSION

General manuscripts should be sent to Theodore C. Harman, editor of the Journal of Electronic Materials at the following address:

Theodore C. Harman
Lincoln Laboratory
Massachusetts Institute of Technology
244 Wood Street
Lexington, MA 02420-9108
Telephone: 781-981-4418
Fax: 781-981-0122
E-mail: tharman@11.mit.edu

Detailed manuscript submission guidelines are available from the JEM web site.


 

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