Bi-Containing Pb-Free Solders
Live Event Date and Time: Thursday, September 15, 2016 • 9:00 a.m. to 10:00 a.m. (EDT)
Instructor: Hongwen Zhang, Indium Corporation
Moderator: Andre Delhaise, University of Toronto
Technical Scope
This webinar will serve as an overview of the latest research into bismuth-containing solders as potential replacement materials for traditional lead-free solder alloys such as Sn-Ag-Cu (SAC). A brief overview of the motivations behind the development of Bi-containing alloys will be covered. A discussion of the most recent findings concerning effects of Bi on microstructure and mechanical properties will also be included. Finally, the current status of these alloys being introduced into RoHS-compliant applications will be outlined.
The goal of this webinar will be to provide the audience with a foundational understanding of the metallurgy and properties of Bi-containing lead-free solder alloys and to project the future reliability of electronic devices manufactured using these alloys as the principal joining materials.
Meet the Instructor
Hongwen Zhang is a research metallurgist in R&D at Indium Corporation. His research is focused on the lead-free solder materials for high-temperature die attach application. He is one of the leading staff members from R&D designing the metallurgy of BiAgX® paste, which won the Surface Mount Technology Association (SMTA) International’s SMTAi Global Technology Award for Indium in 2014. Zhang earned his Ph.D. in materials science and engineering from Michigan Technological University. He also holds an M.S. in both materials science and engineering and mechanical engineering and a B.S. in metallurgical physical chemistry. He has published more than 30 articles in the fields of metallurgy, materials science, physics, mechanics, and electronic interconnection, and has been invited to talk at a number of conferences or consortium meetings. Zhang has a Six Sigma Green Belt and has been certified as an IPC Specialist for ICA-A-600 and IPC-A-610D.
Registration
The live webinar was held on September 15, 2016, but the recording is still available for purchase. Upon registering, event details and link will be provided in a separate e-mail. Register today for this four-part webinar series:
Registration Rates:
(Live event or recorded event)
|
|
Member
|
Nonmember
|
| Standard Rate |
$60 |
$80 |
| Student Rate* |
$30 |
$30 |
| Group Rate |
$180 |
$180 |
* Must be a full-time undergraduate or graduate student to receive the student rate; a copy of student school identification card is required; must e-mail a copy of ID card to
TMS Meeting Services upon registering.
CANCELLATION/REFUND POLICY: TMS reserves the right to cancel this webinar due to low registration; registrants will be notified at least 24 hours prior to the start of the live event and will receive a full refund. If a registrant must cancel, TMS must be notified in writing (by e-mail or mail) before August 11, 2016; payment will be refunded less a $20 processing fee. No refunds will be processed after August 11, 2016.
Sponsors
This four-part webinar series is sponsored by the TMS Functional Materials Division (FMD) and Electronic Packaging & Interconnection Materials Committee.
Thank you to the corporate sponsors of the Electronic Packaging and Interconnect Webinar Series:
