JOURNAL OF ELECTRONIC MATERIALS
	TABLE OF CONTENTS Volume 26, Number 7, July 1997 This Month Featuring: Proceedings of the Symposium on Creep and Stress Relaxation in Miniature Structures, Regular Issue Papers, and the 1997 Electronic Materials Conference Program. View July 1997 Abstracts.

SPECIAL ISSUE PAPERS

Microstructure Coarsening During Thermo-Mechanical Fatigue of Pb-Sn Solder Joints [pp. 774-782]
P.L. Hacke, A.F. Sprecher, and H. Conrad

Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders [pp. 783-790]
H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, and M. Fine

Interfacial Sliding in Cu/Ta/Polyimide High Density Interconnects as a Result of Thermal Cycling [pp. 791-797]
D.V. Zhmurkin, T.S. Gross, and L.P. Buchwalter

Hygrothermal Effects upon Stress Relaxation in a Polyimide Film [pp. 798-804]
Brian D. Harper, Jayathirtha M. Rao, Vernal H. Kenner, and Carl H. Popelar

Thickness Dependent Mechanical Behavior of Submicron Aluminum Films [pp. 805-813]
Young-Seok Kang and Paul S. Ho

Finite Element Modeling of Thermal Fatigue and Damage of Solder Joints in a Ceramic Ball Grid Array Package [pp. 814-820]
Bor Zen Hong

Stress Relaxation in Molding Compounds [pp. 821-826]
Vernal H. Kenner, Brian D. Harper, and Vladimir Y. Itkin

Stress Relaxation and Creep in an Impression Test [pp. 827-832]
James C.M. Li

Stress Relaxation and Creep of 12 to 35 um Copper Foil [pp. 833-838]
H.D. Merchant

Tensile, Creep, and ABI Tests on Sn5%Sb Solder for Mechanical Property Evaluation [pp. 839-846]
K. Linga Murty, Fahmy M. Haggag, and Rao K. Mahidhara

The Short and Long Term Properties of a Liquid Crystalline Polymer at Elevated Temperatures: Characterization and Modeling [pp. 847-851]
A. Saigal, V. Di Filippo, and M.A. Zimmerman

Micro-Indentation Relaxation Measurements in Polymer Thin Films [pp. 852-858]
D.M. Shinozaki and Y. Lu

Impression Recovery of Amorphous Polymers [pp. 859-862]
Fuqian Yang, Shengliang Zhang, and James C.M. Li

REGULAR ISSUE PAPERS

Strain Relaxation in Silicon Ion Molecular Beam Epitaxy on Silicon (001) Substrates During Aging [pp. 868-872]
P. Rozenak

Material Properties of Pb_1-xSn_xSe Epilayers on Si and Their Correlation with the Performance of Infrared Photodiodes [pp. 873-877]
A. Fach, J. John, P. Müller, C. Paglino, and H. Zogg

Microwave Modulated Photoluminescence in Doped GaAs [pp. 878-882]
C.E. Inglefield, M.C. DeLong, P.C. Taylor, and W.A., Harrison

Activation Energies of Intermetallic Growth of Sn-Ag Eutectic Solder on Copper Substrates [pp. 883-887]
D.R. Flanders, E.G. Jacobs, and R.F. Pinizzotto

1997 EMC PROGRAM