The presentations will be privately recorded October 23, 2007, and then made available for download and playback by registrants immediately afterward. Presenters will be available for questions and comments through a discussion board hosted by the Lead-Free Solder Community of Materials Technology@TMS. To keep the interactivity element of the event intact, webinar presenters will monitor this discussion for two months after the event and respond to postings/discussions that may appear as appropriate.

Presentations include:

• "Fundamentals of Tin Whisker Formation"
  Presenter: Carol Handwerker, Purdue University
  Click here for a free preview of the presentation.
• "Industry Issues on Lead-Free Soldering "
  Presenter: David Hillman, Rockwell Collins
  Click here for a free preview of the presentation.
• "Lead-Free Package-on-Package (PoP) for 3D Assembly"
  Presenter: Dongkai Shangguan, Flextronics
  Click here for a free preview of the presentation.

Duration: Approximately 90 minutes.

There is a discounted price, $129, for academic institutions. To receive this price customers should contact TMS Customer Service at (724) 776-9000, ext. 256.

TMS is interested in your thoughts regarding these webcast products. Please e-mail questions or comments to tdunlap@tms.org.

Publisher: TMS
Product Format: Webcast
Date Published: October 23, 2007