Meeting Resources
7th World Congress on Integrated Computational Materials Engineering (ICME 2023)

May 21–25, 2023

Caribe Royale • Orlando, Florida, USA

Register Now
Discount Registration Deadline: April 7, 2023

Submit an Abstract
Abstract Submission Deadline: December 5, 2022

The 7th World Congress on Integrated Computational Materials Engineering (ICME 2023) convenes leading researchers and practitioners to share the latest knowledge and advances in the discipline. This congress is the recognized hub of interaction among software developers and process engineers along the entire production chain, as well as for materials scientists and engineers developing new materials.

This is the only congress dedicated to bringing all stakeholders together from across nations, disciplines, and organizations to focus on integration priorities and gaps that need to be addressed in order to advance the field.

ICME 2023 will benefit researchers, software developers, metallurgists, materials scientists and engineers, process engineers, senior scientists, chief technology officers, and a variety of others working in R&D. Attendees will gain insights on recent advances and discuss opportunities to overcome challenges in the field.

IMPORTANT DATES

Abstract Deadline:
December 5, 2022

Discount Registration Deadline:
April 7, 2023

Housing Deadline:
April 29, 2023

Congress Dates:
May 21–25, 2023

RESOURCES
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MPMD ICME Industry Implementation Award

Andrew Bobel
General Motors Global Research & Development

Accepting on Behalf of General Motors Global Research & Development

This TMS award recognizes the significant achievements that industry has made to implement ICME methods into a manufacturing process and/or design of a new material. It is awarded every two years in conjunction with the ICME World Congress. Award recipients will be honored in-person with the award during the keynote presentation at the congress. This award is intended to honor a company, not a specific individual.

Learn more about the specific criteria for this award and submit an application here.

Congress Sponsors and Organizers

This congress is sponsored by TMS Materials Processing & Manufacturing Division (MPMD) and the Integrated Computational Materials Engineering (ICME) Committee, and is being organized by the following individuals:
Chair Charles Ward, Air Force Research Laboratory, USA
Programming Chair Heather Murdoch, DEVCOM Army Research Laboratory, USA
Committee Durga Ananthanarayanan, IIT Bombay, India
Austin Mann, Boeing, USA
Victoria Miller, University of Florida, USA
Georg Schmitz, MICRESS group at ACCESS, Germany
Kandler Smith, National Renewable Energy Laboratory, USA
Sanjay Sondhi, GE Research, India

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For more information about this meeting, please complete the meeting inquiry form or contact:

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Telephone:
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