Save The Date

Abstract Deadline:
September 30, 2016

Discount Registration Deadline:
April 21, 2017

Housing Deadline:
April 27, 2017

Congress Dates:
May 21–25, 2017

Online Registration
PDF Registration Form
3rd World Congress on Integrated Computational Materials Engineering (ICME 2015)
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Housing and
Sponsorship /
4th World Congress on Integrated Computational Materials Engineering (ICME 2017)
May 21–25, 2017 • Marriott Ann Arbor Ypsilanti at Eagle Crest • Ypsilanti, Michigan, USA
Register Now Registration is now available online or through the PDF registration form.
Register by April 21, 2017 to take advantage of discounted rates.

The 4th World Congress on Integrated Computational Materials Engineering (ICME 2017) convenes leading researchers and practitioners of ICME to share the latest knowledge and advances in the discipline. The congress is now the recognized hub of interaction among software developers and process engineers along the entire production chain, as well as for materials scientists and engineers developing new materials. This is the only conference dedicated to bringing all stakeholders together from across nations, disciplines, and organizations to focus on integration priorities and gaps that need to be addressed in order to advance the field.

At ICME 2017, attendees will gain insights on recent advances, new challenges, and the roadmap for overcoming them, giving them the opportunity to discuss and influence actual trends in the field. Attendees will learn techniques for combining different models and tools in view of understanding, optimizing, and designing processes for both new and established materials. Visit the Technical Program page for more information on technical topics to be covered by this congress.

This congress is sponsored by the TMS Integrated Computational Materials Engineering Committee of the Materials Processing & Manufacturing Division, and is being organized by the following individuals:
Chair Paul Mason, Thermo-Calc Software Inc.
Co-Chairs Charles Fisher, Naval Surface Warfare Center – Carderock Division
Ryan Glamm, Boeing, USA
Michele Manuel, University of Florida, USA
Georg J. Schmitz, MICRESS group at ACCESS e.V.
Amarendra Singh, Indian Institute of Technology, Kanpur, India
Ale Strachan, Purdue University, USA
  • Dipankar Banerjee, Indian Institute of Science, India
  • Annika Borgenstam, KTH – Royal Institute of Technology, Sweden
  • Masahiko Demura, University of Tokyo, Japan
  • Dennis Dimiduk, BlueQuartz, LLC, USA
  • B.P. Gautham, Tata Consulting Services, India
  • Liang Jiang, Central South University, China
  • Kai-Friedrich Karhausen, Hydoaluminium, Germany
  • Peter Lee, Imperial College, UK
  • Mei Li, Ford Motor Company, USA
  • Baicheng Liu, Tsinghua University, China
  • Javier Llorca, IMDEA, Spain
  • Jiangfeng Nie, Monash University, Australia
  • Warren Poole, University of British Columbia, Canada
  • Antonio J. Ramirez, The Ohio State University, USA
  • James Warren, National Institute of Standards and Technology, USA
  • Erich Wimmer, Materials Design, France

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
Telephone (724) 776-9000, ext. 241
(800) 759-4TMS (4867)
Fax: (724) 776-3770