2023
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FMD JEM Best Paper Award
Ningzhong Bao -
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- Affiliation: Zhejiang University, Hangzhou, Zhejiang, China
- Other: "Graphene-Assisted Synthesis of Fe4N with Enhanced Microwave", Journal of Electronic Materials, March 2022
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2023
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FMD JEM Best Paper Award
Xianping Fan -
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- Affiliation: Zhejiang University, Hangzhou, Zhejiang, China
- Other: "Graphene-Assisted Synthesis of Fe4N with Enhanced Microwave", Journal of Electronic Materials, March 2022
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2023
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FMD JEM Best Paper Award
Jie Ren -
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- Affiliation: Zhejiang University, Hangzhou, Zhejiang, China
- Other: "Graphene-Assisted Synthesis of Fe4N with Enhanced Microwave", Journal of Electronic Materials, March 2022
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2023
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FMD JEM Best Paper Award
Hui Yang -
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- Affiliation: Zhejiang University, Hangzhou, Zhejiang, China
- Other: "Graphene-Assisted Synthesis of Fe4N with Enhanced Microwave", Journal of Electronic Materials, March 2022
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2023
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FMD JEM Best Paper Award
Lingjie Zhang -
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- Affiliation: Zhejiang University, Hangzhou, Zhejiang, China
- Other: "Graphene-Assisted Synthesis of Fe4N with Enhanced Microwave", Journal of Electronic Materials, March 2022
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2022
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FMD JEM Best Paper Award
Hongyan Du -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Runhua Fan -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Xueyan Fu -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Chuanxin Hou -
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- Title: Yantai University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Yuliang Jiang -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Rui Tian -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Shengmei Wei -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Wenjin Zhang -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Zidong Zhang -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2022
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FMD JEM Best Paper Award
Guojing Zhao -
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- Title: Shandong University
- Other: “Porous Fe@Fe3O4-C Nanocomposite Using Polyvinyl Alcohol Sponge as Template for Microwave Absorption,” Journal of Electronic Materials, November 2020.
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2021
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FMD JEM Best Paper Award
M. Chandrashekhar -
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- Affiliation: University of South Carolina, Columbia, SC
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2027
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2021
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FMD JEM Best Paper Award
Venkata Chava -
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- Affiliation: University of South Carolina, Columbia, SC
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2023
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2021
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FMD JEM Best Paper Award
Robert Davis -
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- Title: Professor
- Affiliation: Carnegie Mellon University, Pittsburgh, PA
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2025
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2021
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FMD JEM Best Paper Award
Andrew Greytak -
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- Title: Professor
- Affiliation: University of South Carolina, Columbia, SC
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2028
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2021
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FMD JEM Best Paper Award
Matthew Kelley -
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- Affiliation: University of South Carolina, Columbia, SC
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2024
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2021
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FMD JEM Best Paper Award
Luke Lyle -
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- Affiliation: Carnegie Mellon University, Pittsburgh, PA
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2021
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2021
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FMD JEM Best Paper Award
Serdal Okur -
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- Affiliation: Structured Materials Industries, Inc, Piscataway, NJ
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2022
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2021
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FMD JEM Best Paper Award
Lisa Porter -
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- Title: Professor
- Affiliation: Carnegie Mellon University, Pittsburgh, PA
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2020
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2021
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FMD JEM Best Paper Award
Gary Tompa -
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- Affiliation: Structured Materials Industries, Inc, Piscataway, NJ
- Other: Characterization of Epitaxial b-(Al,Ga,In)2O3-Based Films and Applications as UV Photodetectors, November 2026
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2020
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FMD JEM Best Paper Award
Ryoichi Akimoto -
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- Affiliation: National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaraki, Japan
- Other: "Recombination-Enhanced Effect in Green/Yellow Luminescence from BeZnCdSe Quantum Wells Grown by Molecular Beam Epitaxy," JEM, August 2018
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2020
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FMD JEM Best Paper Award
Aibing Chen -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Xinyu Fu -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Meng Liu -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Lei Liu -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Guoxu Wang -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Yifeng Yu -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Lili Zhang -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2020
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FMD JEM Best Paper Award
Yixin Zhang -
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- Affiliation: Hebei University of Science and Technology, Shijiazhuang, China
- Other: "Porous Carbon Nanosheets Prepared from Plastic Wastes for Supercapacitors,"JEM, October 2018
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2019
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FMD JEM Best Paper Award
No award given.
- Title:
- Affiliation: ,
- Quote: N/A
- Citation: N/A
- Other: N/A
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2018
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FMD JEM Best Paper Award
Tong An -
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- Affiliation: Beijing University of Technology, Beijing, China
- Other: "Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading", JEM, October 2017
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2018
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FMD JEM Best Paper Award
Si Chen -
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- Affiliation: Beijing University of Technology, Beijing, China
- Other: "Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading", JEM, October 2017
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2018
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FMD JEM Best Paper Award
Pei Chen -
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- Title: Lecturer
- Affiliation: Beijing University of Technology, Beijing, China
- Other: "Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading", JEM, October 2017
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2018
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FMD JEM Best Paper Award
Fei Qin -
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- Title: Professor
- Affiliation: Beijing University of Technology, Beijing, China
- Other: "Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading", JEM, October 2017
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2015
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FMD JEM Best Paper Award
Raymundo Arroyave -
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- Title: Assistant Professor
- Affiliation: Texas A&M University, College Station, TX
- Other: "Confinement Effects on Evolution of Intermetallic Compounds during Metallurgical Joint Formation"
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2015
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FMD JEM Best Paper Award
Sean Gibbons -
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- Title: Student
- Affiliation: Naval Post-Graduate School, College Station, TX
- Other: "Confinement Effects on Evolution of Intermetallic Compounds during Metallurgical Joint Formation"
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2015
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FMD JEM Best Paper Award
MinSoo Park -
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- Title: Senior Engineer
- Affiliation: SK Hynix, Ichen, Korea
- Other: "Confinement Effects on Evolution of Intermetallic Compounds during Metallurgical Joint Formation"
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2014
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FMD JEM Best Paper Award
Emmanuel Cadel -
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- Affiliation: Universite et INSA de Rouen,
- Other: Micro- and Nanostructure of Zn Whiskers and Their Coating, Journal of ELECTRONIC MATERIALS, Vol. 42, No. 2, 2013
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2014
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FMD JEM Best Paper Award
Laurent Cretinon -
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- Affiliation: EDF R&D,
- Other: Micro- and Nanostructure of Zn Whiskers and Their Coating, Journal of ELECTRONIC MATERIALS, Vol. 42, No. 2, 2013
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2014
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FMD JEM Best Paper Award
Auriane Etienne -
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- Title: Research Engineer
- Affiliation: University of Rouen / Groupe de Physique des Matériaux, France
- Quote: It is a surprise because this is the first time we devoted our instrumental platform to electronic materials, and particularly to whiskers. This is a real recognition and encouragement that shows that our approach was new and beneficial to this scientific community. We hope that being awarded and members of the large TMS society will facilitate future collaborations. We would like to thank TMS and the Electronic, Magnetic, and Photonic Materials Division.
- Other: Micro- and Nanostructure of Zn Whiskers and Their Coating, Journal of ELECTRONIC MATERIALS, Vol. 42, No. 2, 2013
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2014
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FMD JEM Best Paper Award
Agnes Lina -
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- Affiliation: EDF R&D,
- Other: Micro- and Nanostructure of Zn Whiskers and Their Coating, Journal of ELECTRONIC MATERIALS, Vol. 42, No. 2, 2013
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2014
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FMD JEM Best Paper Award
Philippe Jean Pareige -
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- Affiliation: Universite et INSA de Rouen,
- Other: Micro- and Nanostructure of Zn Whiskers and Their Coating, Journal of ELECTRONIC MATERIALS, Vol. 42, No. 2, 2013
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2013
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FMD JEM Best Paper Award
Stephen Bedell -
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- Affiliation: IBM T.J. Watson Research Center, Yorktown Heights, NY
- Other: "Low Temperature Epitaxy of Compressively Strained Silicon Directly on Silicon Substrates"
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2013
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FMD JEM Best Paper Award
Bahman Hekmatshoar -
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- Affiliation: IBM T.J. Watson Research Center, Yorktown Heights, NY
- Other: "Low Temperature Epitaxy of Compressively Strained Silicon Directly on Silicon Substrates"
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2013
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FMD JEM Best Paper Award
Marco Hopstaken -
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- Affiliation: IBM T.J. Watson Research Center, Yorktown Heights, NY
- Other: "Low Temperature Epitaxy of Compressively Strained Silicon Directly on Silicon Substrates"
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2013
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FMD JEM Best Paper Award
Devendra Sadana -
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- Affiliation: IBM T.J. Watson Research Center, Yorktown Heights, NY
- Other: "Low Temperature Epitaxy of Compressively Strained Silicon Directly on Silicon Substrates"
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2013
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FMD JEM Best Paper Award
Davood Sharhrjerdi -
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- Affiliation: IBM T.J. Watson Research Center, Yorktown Heights, NY
- Quote: I would like to thank TMS for selecting our paper for this prestigious award. TMS has always been a leading organization promoting advancement in the filed of materials science. The recognition of our work by TMS is a source of great encouragement to continue our endeavors towards excellence in research. It is a tremendous honor for me to accept this award on behalf of my colleagues who have contributed in this work.
- Other: "Low Temperature Epitaxy of Compressively Strained Silicon Directly on Silicon Substrates"
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2012
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FMD JEM Best Paper Award
Oliver Graudejus -
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- Affiliation: Arizona State University, Tempe, AZ
- Other: "Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit", JEM Vol 40, No. 6 2011
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2012
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FMD JEM Best Paper Award
Joyelle Harris -
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- Affiliation: Exponent Failure Analysis Associates, Phoenix, AZ
- Quote: This award helps highlight some of the many applications for stretchable metals. The award also brings awareness to advances in the technology for developing stretchable electronics. We hope other scientists can build upon the research presented in this paper, and we thank the Minerals, Metals, & Materials Society for honoring us with this award.
- Other: "Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit", JEM Vol 40, No. 6 2011
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2012
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FMD JEM Best Paper Award
Sigurd Wagner -
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- Affiliation: Princeton University, Princeton, NJ
- Other: "Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit", JEM Vol 40, No. 6 2011
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2011
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FMD JEM Best Paper Award
Christopher Kinney -
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- Affiliation: University of California , Berkeley, CA
- Quote: “I would like to thank the editors at JEM for such a nice award. I was surprised and humbled to receive this award from a journal with such excellent content; and I think it is very encouraging to other young authors as well. JEM and TMS are wonderful forums for the advancement of the scientific field, and I am very appreciative of all the work that goes into making it happen. Lastly I would like to thank my co-authors and my family, for there wouldn't have been any paper without their support.”
- Other: "The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects" ( Co-Authors: Tae-Kyu Lee, Kuo-Chuan Liu, J.W. Morris)
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