Localized Mechanical Property Assessment in Electronic Materials and Systems
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Manuscript Submission Deadline:
November 01, 2024
(Manuscripts not accepted more than 6 months prior to this date)
Publication Date: May 2025
Keywords: Electronic Materials, Mechanical Properties, Surface Modification and Coatings, Synthesis and Processing, Thin Films and Interfaces
Scope: Electronic devices found in consumer electronics, high performance computing, or power electronics are enabled by material science advances. In order to further advance computing power, new challenges in packaging, chiplet design, and power delivery need to be addressed. Thermal and mechanical properties in the chip ecosystem are key elements that must be understood and characterized. Nanomechanical testing and characterization are needed to ensure reliable performance of these systems. We invite papers featuring mechanical as well as combined tests (thermal-mechanical, electrical-mechanical, etc.) and evaluations of materials and composites relevant for electronic applications.
Call for Papers:
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