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JOM Editorial Calendar - Topic Details

Materials for High Reliability Devices

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This topic is no longer accepting submissions.

Guest Editor: Albert T. Wu

Co-Guest Editors: Babak Arfaei

Sponsored By: Electronic Packaging and Interconnection Materials

Publication Date: February 2021

Keywords: Electronic Materials, Energy Conversion and Storage, Intermetallics, Mechanical Properties, Phase Transformations

Scope: This topic invites papers that are related to high reliability devices for autonomous car or wide bandgap applications. Materials that are used for energy conversion devices are also included.

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JOM Editorial Calendar - Topic Details

Materials for High Reliability Devices

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