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JOM Editorial Calendar - Topic Details

Advanced Technology for Electronic Packaging and Interconnection Materials

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Guest Editor: Albert T Wu

Sponsored By: Electronic Packaging and Interconnection Materials

Publication Date: June 2024

Keywords: Advanced Materials, Electronic Materials, Intermetallics, Joining, Thin Films and Interfaces

Scope: Advanced progress in device requires developing new materials and technologies to meet the electrical, thermal, mechanical, reliability and sustainable environment demands. The special topic will address current research in new and existing materials for emerging technology of interconnection and electronic packaging.

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JOM Editorial Calendar - Topic Details

Advanced Technology for Electronic Packaging and Interconnection Materials

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