JOM Editorial Calendar - Topic Details

Low-temperature Technology for Electronic Packaging and Interconnects

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Guest Editor: Albert T Wu
Co-Guest Editors: Babak Arfaei
Publication Date: May 2022
Keywords: Electronic Materials, Joining, Molten Metal and Solidification, Phase Transformations, Powder Technology, Low-temperature Materials
Scope: This special topic focuses on low-temperature technology for electronic packaging and interconnects.