JOM Editorial Calendar - Topic Details

Low-temperature Technology for Electronic Packaging and Interconnects

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Guest Editor: Albert T Wu

Co-Guest Editors: Babak Arfaei

Sponsored By: Electronic Packaging and Interconnection Materials

Publication Date: May 2022

Keywords: Electronic Materials, Joining, Molten Metal and Solidification, Phase Transformations, Powder Technology, Low-temperature Materials

Scope: This special topic focuses on low-temperature technology for electronic packaging and interconnects.

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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JOM Editorial Calendar - Topic Details

Low-temperature Technology for Electronic Packaging and Interconnects

How to Submit a Manuscript

Share this Topic

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