Continuing advances in microelectronic, opto-electronic and nano-electronic
devices require new materials and technologies to meet the increasing
electrical, thermal, mechanical, reliability, performance and environmental
demands placed on interconnects and packaging at all levels. This symposium
will address current research in packaging materials and processes, including
Pb free solders, Ag and Cu sintering, hybrid bonding, conductive adhesives,
epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability,
and failure analysis.
Topics of interest include, but are not limited to:
* Packaging materials and processes for next generation packages, e.g., 3D
packaging, wafer level packaging, photonic packaging, Internet of Things (IoT),
flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps,
Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive
adhesive, optoelectronic interconnects, transient liquid phase bonding,
sintered nano-powder joints, polymer core solder balls and alternative
interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal
interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnections,
plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects
for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder
joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental material behavior including phase transformations, computational
thermodynamics, solidification, microstructure evolution, micromechanics,
corrosion, mechanical, thermal, and electrical properties of solders and
intermetallic compounds
Additive manufacturing has immense potential for design flexibility and
simplified processing for precision, high resolution structures with robust
mechanical properties. This symposium will focus on novel techniques, feedstock
materials, characterization, and predictive simulations for additive
manufacturing of structures with nano to microscale dimensions, as well as bulk
structures with tailored internal nano/microscale features. A designated focus
will be the description and validation of materials performance, in particular,
the mechanical behaviour of manufactured structures.
Topics of interest include additive techniques based on (but not limited to)
multiphoton lithography, laser or e-beam sintering/melting, cold spray, aerosol
deposition, inkjet, electrodeposition and hybrid methods, and material systems
including polymers, metals, ceramics, and nanocomposites. The functional
properties, mechanical behaviour and lifetime of nano and micro additively
manufactured materials and structures are also of high interest in this
symposium.
Continuing advances in microelectronic, opto-electronic and nano-electronic
devices require new materials and technologies to meet the increasing
electrical, thermal, mechanical, reliability, performance and environmental
demands placed on interconnects and packaging at all levels. This symposium
will address current research in packaging materials and processes, including
Pb free solders, Ag and Cu sintering, hybrid bonding, conductive adhesives,
epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability,
and failure analysis.
Topics of interest include, but are not limited to:
* Packaging materials and processes for next generation packages, e.g., 3D
packaging, wafer level packaging, photonic packaging, Internet of Things (IoT),
flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps,
Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive
adhesive, optoelectronic interconnects, transient liquid phase bonding,
sintered nano-powder joints, polymer core solder balls and alternative
interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal
interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnections,
plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects
for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder
joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental material behavior including phase transformations, computational
thermodynamics, solidification, microstructure evolution, micromechanics,
corrosion, mechanical, thermal, and electrical properties of solders and
intermetallic compounds
Continuing advances in microelectronic, opto-electronic and nano-electronic
devices require new materials and technologies to meet the increasing
electrical, thermal, mechanical, reliability, performance and environmental
demands placed on interconnects and packaging at all levels. This symposium
will address current research in packaging materials and processes, including
Pb free solders, alternative interconnects, conductive adhesives, epoxy,
substrates, 3D packaging, wafer level packaging, quality, reliability, and
failure analysis.
Topics of interest include, but are not limited to:
* Packaging materials and processes for next generation packages, e.g., 3D
packaging, wafer level packaging, photonic packaging, Internet of Things (IoT),
flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps,
Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive
adhesive, optoelectronic interconnects, transient liquid phase bonding,
sintered nano-powder joints, polymer core solder balls and alternative
interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal
interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnect,
plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects
for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder
joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental materials behavior including phase transformations, computational
thermodynamics, solidification, microstructure evolution, corrosion,
mechanical, thermal, and electrical properties of solders and intermetallic
compounds
Continuing advances in microelectronic, optoelectronic and nanoelectronic
devices require new materials and technologies to meet the increasing
electrical, thermal, mechanical, reliability, performance and environmental
demands placed on interconnects and packaging at all levels. This symposium
will address current researches in packaging materials and processes, including
Pb-free and low melting temperature solders, microstructure-design, alternative
interconnects, conductive adhesive, epoxy, 3D packaging and heterogeneous
integration, wafer level packaging, interconnect reliability, and root cause
failure analysis.
Topics of interest include, but are not limited to:
- Advanced packaging materials and processes, e.g., 3D packaging and
heterogeneous integration, wafer level packaging, photonic packaging, Internet
of Things (IoT), flexible electronics, wire bonding and connectors, automotive
and power electronics
- Interconnects for packages, e.g., Pb-free solder, micro bumps,
through-silicon-vias (TSVs), direct Cu to Cu bonding, conductive adhesive,
transient liquid phase bonding, sintered nano powder joints, optoelectronic
interconnects, Cu and Ag paste sintering and alternative interconnect materials
at chip and package levels
- Additive manufacturing and 3D printing for electronics industry
- Other packaging materials, e.g., epoxy, molding compounds, epoxy flux,
thermal interface material (TIM), and substrate materials
- Reliability and failure analysis for next generation packages
- Continuing challenges in implementing Pb-free solders for interconnect, low
melting temperature solder alloys and solder interconnect materials for extreme
environment application.
- Developments in next-generation solders for improved reliability for space
exploration and aerospace application.
- Developments in solder materials and associated interconnects for automotive
and power electronics
- Developments in high temperature and cryogenic temperature solder materials
and associated interconnects
- Electromigration, thermo-migration, stress-migration and mechanical effects
- Whisker growth in Sn, Sn-based alloys and other metallic systems
- Advanced characterization methods as applied to interconnect technology
- Fundamental materials behavior including phase transformations, computational
thermodynamics, solidification, microstructure evolution, corrosion,
mechanical, thermal, and electrical properties of solders and intermetallic
compounds
Continuing advances in microelectronic, optoelectronic and nanoelectronic
devices require new materials and technologies to meet the increasing
electrical, thermal, mechanical, reliability, performance and environmental
demands placed on interconnects and packaging at all levels. This symposium
will address current researches in packaging materials and processes, including
Pb-free solders, microstructure-design, alternative interconnects, conductive
adhesive, epoxy, 3D packaging, wafer level packaging, reliability, and root
cause analysis.
Topics of interest include, but are not limited to:
* Advanced packaging materials and processes, e.g., 3D packaging, wafer level
packaging, photonic packaging, Internet of Things (IoT), flexible electronics,
wire bonding, automotive and power electronics
* Interconnects for packages, e.g., Pb-free solder, micro bumps,
through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive
adhesive, transient liquid phase bonding, sintered nano powder joints,
optoelectronic interconnects, and alternative interconnect materials at chip
and package levels
* Additive manufacturing and 3D printing for electronics industry
* Other packaging materials, e.g., epoxy, molding compounds, epoxy flux,
thermal interface material (TIM), and substrate materials
* Reliability and failure analysis for next generation packages
* Continuing challenges in implementing Pb-free solders for interconnect,
plating and thermal interface material (TIM) applications
* Developments in next-generation Pb-free solders for improved reliability
* Developments in high temperature Pb-free solders and associated interconnects
for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder
joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental materials behavior including phase transformations, computational
thermodynamics, solidification, microstructure evolution, corrosion,
mechanical, thermal, and electrical properties of solders and intermetallic
compounds
Continuing advances in microelectronic, optoelectronic and nanoelectronic
devices require new materials and technologies to meet the increasing
electrical, thermal, mechanical, reliability, performance and environmental
demands placed on interconnects and packaging at all levels. This symposium
will address current research in Packaging Materials and Processes, including
Pb free solders, alternative interconnects, conductive adhesive, epoxy,
substrates, 3D packaging, wafer level packaging, quality, reliability, and
failure analysis.
Topics of interest include, but are not limited to:
* Packaging materials and Processes for next generation packages, e.g., 3D
packaging, wafer level packaging, photonic packaging, Internet of Things (IoT),
flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps,
Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive
adhesive, optoelectronic interconnects, transient liquid phase bonding,
sintered nano-powder joints, and alternative interconnect materials at chip and
package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal
interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnect,
plating and thermal interface material (TIM) applications
* Developments in next-generation Pb-free solders for improved reliability
* Developments in high temperature Pb-free solders and associated interconnects
for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder
joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental materials behavior including phase transformations, computational
thermodynamics, solidification, microstructure evolution, corrosion,
mechanical, thermal, and electrical properties of solders and intermetallic
compounds