Electronic Packaging and Interconnect Materials Webinar Series

Learn more about each of the four webinars in this series on electronic packaging and interconnect materials:

Webinar 1
  • Thursday, August 18, 2016
  • 9:00 a.m. to 10:00 a.m. (EDT)
  • Instructors: Tae-Kyu Lee, Portland State University, and Tan Li, Intel
Webinar 2
  • Thursday, August 25, 2016
  • 9:00 a.m. to 10:00 a.m. (EDT)
  • Instructors: Eric Chason, Brown University, and Carol Handwerker, Purdue University
Webinar 3
  • Thursday, September 1, 2016
  • 9:00 a.m. to 10:00 a.m. (EDT)
  • Instructors: Christopher Gourlay, Imperial College London, and Kazuhiro Nogita, University of Queensland
Webinar 4
  • Thursday, September 15, 2016
  • 9:00 a.m. to 10:00 a.m. (EDT)
  • Instructor: Hongwen Zhang, Indium Corporation

About the Webinar Series

Technical Scope
The goal of the webinar lectures will be to highlight topics within the electronic packaging and interconnect design pertinent to current research being conducted in the community. Each webinar will be co-presented by a two-person team of subject matter experts and will offer the opportunity to delve into the selected topic in more depth and discussion than would normally be achieved in the standard conference presentation setting. This program is based on the successful Lead-Free Solders and Interconnect Technology Workshop, held at the TMS Annual Meeting & Exhibition for the past 12 consecutive years.

The topics have been chosen to target analysis and discussion of a broad variety of microelectronic materials design considerations in terms of applied metallurgy and microstructural control of interconnect devices. One of the main objectives of this webinar series is to provide enhanced conversations regarding the fundamentals of these topics for graduate students. The details and concepts covered can be readily applied by students and industry professionals alike in their research concerning lead-free solders and microelectronics systems.

Who Should Attend
Graduate students, researchers, academics, and industry professionals within the materials community who are already familiar with microelectronics packaging and interconnect design will all benefit from attending these webinar lectures and participating in the discussion on foundational topics and techniques within the field and projections of future design and experimental considerations. Additionally, the webinars aim to benefit the enhanced education and involvement of students in the electronics packaging community.

The live webinars were held in August and September 2016, but the recordings are still available for purchase.

Registration Rates:
(Live event or recorded event)

  Member Nonmember
Standard Rate $60 $80
Student Rate* $30 $30
Group Rate $180 $180
* Must be a full-time undergraduate or graduate student to receive the student rate; a copy of student school identification card is required; must e-mail a copy of ID card to TMS Meeting Services upon registering.

CANCELLATION/REFUND POLICY: TMS reserves the right to cancel this webinar due to low registration; registrants will be notified at least 24 hours prior to the start of the live event and will receive a full refund. If a registrant must cancel, TMS must be notified in writing (by e-mail or mail) before August 11, 2016; payment will be refunded less a $20 processing fee. No refunds will be processed after August 11, 2016.

Webinar Organizers and Sponsors

This four-part webinar series is sponsored by the TMS Functional Materials Division (FMD) and Electronic Packaging & Interconnection Materials Committee, and has been organized by the following individuals:

Andre Delhaise, University of Toronto
Arif Mohd Salleh, University of Queensland
Kathlene Reeve, Purdue University

Thank you to the corporate sponsors of the Electronic Packaging and Interconnect Webinar Series:

Webinar Series Home | Webinar 1 | Webinar 2 | Webinar 3 | Webinar 4