JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

Manuscript Submission Deadline: April 01, 2019

Sponsored By: Alloy Phases

Publication Date: September 2019

Keywords: Advanced processing, alloy phases, electronic materials, joining, phase transformations

Scope: Papers are invited for this special topic covering recent advances of bonding technologies for 2.5D and 3D IC, wide-band-gap (WBG) semiconductors, and flexible electronics.

Call for Papers:

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How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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JOM Editorial Calendar - Topic Details

Advanced Electronic Interconnection

How to Submit a Manuscript

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