JOM Editorial Calendar - Topic Details

Progress with Lead-Free Solders

Manuscript Submission Deadline: September 01, 2019
Guest Editor: Chris Gourlay
Co-Guest Editors: Babak Arfaei
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Publication Date: February 2020
Keywords:
Scope: Pb-free solders are now in widespread use and can out-perform Pb-based materials in many applications. Despite this success, there is an ongoing need to develop next-generation interconnection materials for smaller joints that can operate in more extreme environments and that are more reliable. This topic covers recent advances in solder alloy design for harsh environments, new interconnection materials and bonding technologies, and advances in the understanding of electronics reliability.
Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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