JOM Editorial Calendar - Topic Details

Interfacial Stability in Multi-component Systems

Manuscript Submission Deadline: May 01, 2020
Guest Editor: Chao-hong Wang
Co-Guest Editors: Shih-Kang Lin
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Sponsored By: Alloy Phases
Publication Date: October 2020
Keywords: Alloy Phases, Electronic Materials
Scope: Papers are invited for this special topic covering interfacial bonding, interfacial stability, reaction kinetics, phase formation and characterization, and complex interfacial phenomena in various applied fields, including advanced microelectronics packaging, semiconductor systems, thermoelectric modules, energy materials and other related interfacial systems.
Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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