JOM Editorial Calendar - Topic Details

Advanced Technology for Electronic Packaging and Interconnection Materials

Manuscript Submission Deadline: December 01, 2023
Guest Editor: Albert T Wu
Co-Guest Editor:
Publication Date: June 2024
Keywords: Advanced Materials, Electronic Materials, Intermetallics, Joining, Thin Films and Interfaces
Scope: Advanced progress in device requires developing new materials and technologies to meet the electrical, thermal, mechanical, reliability and sustainable environment demands. The special topic will address current research in new and existing materials for emerging technology of interconnection and electronic packaging.
Call for Papers: Download

How to Submit a Manuscript

Please read the detailed Instructions for Authors and upload your manuscript at the Editorial Manager website for JOM. To ensure sufficient time for peer review, papers will not be accepted after the posted manuscript submission deadline. Original research papers should be 3,000-9,000 words with up to 12 figures maximum; review papers should be 6,000-11,000 words with up to 20 figures maximum.

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