Advances in Electronic Interconnection Materials
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This topic is no longer accepting submissions.
Manuscript Submission Deadline:
August 01, 2018
Publication Date: January 2019
Keywords: Electronic Materials,Intermetallics,Lead, Zinc, and Tin
Scope: This topic will include papers on Pb-free solder development, advances in the understanding of joint reliability and emerging interconnection materials for harsh environments.
Call for Papers:
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