"Advances in the Resistance Welding of Automotive Aluminum" (Innovations in Aluminum, Part I), C.L. Tsai, May 1997, pp. 28-30.

"Ag₃Sn Plate Formation in the Solidification of Near-Ternary Eutectic Sn-Ag-Cu" (Research Summary), Sung K. Kang, Won Kyoung Choi, Da-Yuan Shih, Donald W. Henderson, Timothy Gosselin, Amit Sarkhel, Charles Goldsmith, and Karl J. Puttlitz, June 2003, pp. 61-65.

"Applying TLP Bonding to the Joining of Structural Intermetallic Compounds" (Overview), W.F. Gale, February 1999, pp. 49-52.

"Aspects of Structural Evolution of Lead-Free Solder Joints" (Research Summary), A. Zribi, R. Kinyanjui, P. Borgensen, L. Zavalij, and E.J. Cotts, June 2002, pp. 38-40.

"The Bonding of Nanowire Assemblies Using Adhesive and Solder" (Research Summary), Z. Gu, H. Ye, and D.H. Garcias, December 2005, pp. 60-64.

"Ceramic-Metal Interfaces and the Spreading of Reactive Liquids" (Overview), A. Meier, D.A. Javernick, and G.R. Edwards, February 1999, pp. 44-47 (Note: A correction appears in November 1999, p. 10).

"Characteristics of EB-Weldable Molybdenum and Mo-Re Alloys" (Research Summary), F. Morito, June 1993, pp. 54-58.

"Characterizing Al Tailor-Welded Blanks for Automotive Applications" (Overview), R.W. Davies, H.E. Oliver, M.T. Smith, and G.J. Grant, November 1999, pp. 46-50.

"The Chemical Modeling of Electronic Materials and Interconnections" (Overview), J.K. Kivilahti, December 2002, pp. 52-57.

"Composition and Heat-Treatment Effects on the Adhesion Strength of Sn-Zn-Al Solders on Cu Substrate" (Research Summary), S.-P. Yu, H.-C. Wang, M.-H. Hon, and M.-C. Wang, June 2000, pp. 36-39.

"The Compression Stress-Strain Behavior of Sn-Ag-Cu Solder" (Research Summary), Paul T. Vianco, Jerome A. Rejent, and Joseph J. Martin, June 2003, pp. 50-55.

"Controlling Ag₃Sn Plate Formation in Near-TYernary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying" (Research Summary), S.K. Kang, D.-Y. Shih, D. Leonard, D.W. Henderson, T. Gosselin, S.-I. Cho, H. Yu, and W.K. Choi, June 2004, pp. 34-38.

"Converting to Lead-Free Solders: An Automotive Industry Perspective" (Overview), W.L. Winterbottom, July 1993, pp. 20-24.

"Creep Deformation Behavior of Sn-3.5Ag Solder at Small Length Scales" (Research Summary), M. Kerr and N. Chawla, June 2004, pp. 50-54.

"The Creep Properties of Lead-Free Solder Joints" (Research Summary), H.G. Song, J.W. Morris, Jr., and F. Hua, June 2002, pp. 30-32.

"The Creep Properties of Precipitation-Strengthened Tin-Based Alloys" (Research Summary), R.J. McCabe and M.E. Fine, June 2000, pp. 36-39.

"Creep Properties of Sn-Ag Solder Joints Containing Intermetallic Particles" (Research Summary), S. Choi, J.G. Lee, F. Guo, T.R. Bieler, K.N. Subramanian, and J.P. Lucas, June 2001, pp. 22-26.

"Developing Lead-Free Solders: A Challenge and Opportunity" (Commentary), S. Jin, July 1993, p. 13.

"The Development of the COST 531 Lead-Free Solders Thermodynamic Database" (Overview), A. Kroupa, A.T. Dinsdale, A. Watson, J. Vrestal, J. Vizdal, and A. Zemanova, July 2007, pp. 20-25.

"Developments in Lead-Free Solders and Soldering Technology" (Commentary), Sung K. Kang, June 2002, p. 25.

"Diffusion Soldering for Stable High-Temperature Thin-Film Bonds" (Overview), T. Studnitzky and R. Schmid-Fetzer, December 2002, pp. 58-63.

"Dimensionally Stable Solders for Optoelectronics and Microelectronics" (Commentary), H. Mavoori, June 2000, p. 29.

"Dispersion Strengthening for Dimensionally Stability in Low-Melting-Point Solders" (Research Summary), H. Mavoori and S. Jin, June 2000, pp. 30-32.

"Drawn Arc Aluminum Stud Welding for Automotive Applications" (Research Summary), S. Ramasamy, August 2002, pp. 44-46.

"Dynamic Mismatch Between Bonded Dissimilar Materials" (Overview), C.H. Li, June 1993, pp. 43-46.

"The Effect of Reflow Process Variables on the Wettability of Lead-Free Solders" (Research Summary), C. Melton, July 1993, pp. 33-35.

"The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact Reliability of Solder Joints" (Research Summary), W. Liu and N.-C. Lee, July 2007, pp. 26-31.

"The Effects of Cooling Rates on Microstructure and Mechanical Behavior of Sn-3.5Ag Solder" (Research Summary), F. Ochoa, J.J. Williams, and N. Chawla, June 2003, pp. 56-60.

"Electrical Measurement of a Lead-Free Solder Assembly after Environmental Tests by SEM Internal Probing" (Research Summary), T.I. Shih, Y.C. Lin, J.G. Duh, T. Hsu, and W.S. Wu, July 2007, pp. 32-34.

"Electromigration Effects upon Interfacial Reactions" (Overview), S.-W. Chen and C.-M. Chen, February 2003, pp. 62-67.

"Electromigration in Solder Joints and Solder Lines" (Research Summary), H. Gan, W.J. Choi, G. Xu, and K.N. Tu, June 2002, pp. 34-37.

"Experiments for First-Year Engineering Students Using Tin-Bismuth Alloys" (Feature), Mark A. Palmer, Kurt Wainwright, Lung C. Fok, and Benjamin Jones, June 2002, pp. 41-44.

"Fabricating Niobium Test Loops for the SP-100 Space Reactor" (Overview), A.J. Bryhan and R.C. Chan, June 1993, pp. 50-53.

"Fatigue Testing Welded Joints for P/M Al-Matrix Composites" (Research Summary), W.C. Harrigan, Jr., July 1994, pp. 52, 53.

"Growth of η Phase Scallops and Whiskers" (Overview), Robert A. Gagliano and Morris E. Fine, June 2001, pp. 33-38.

"The GTAW of Ti-6Al-4V Castings and its Effect on Microstructural and Mechanical Properties" (Research Summary), J. Ault, J. Pillers, and S. Veeck, November 2005, pp. 62-65.

"High-Energy Electron-Beam Welding and Processing" (Conference Review), F.H. Froes, June 1993, pp. 59, 60.

"High Temperature Lead-free Solder for Microelectronics" (Overview), F.R. Gayle, G. Becka, J. Badgett, G. Whitten, T.-Y. Pan, A. Grusd, B. Bauer, R. Lathrop, J. Slattery, I. Anderson, J. Foley, A. Gickler, D. Napp, J. Mather, and C. Olson, June 2001, pp. 17-21.

"The Hyper-Pressure Pulse Bonding of Aluminum" (Overview), J. Kollé, August 1998, pp. 29-31.

"The Infrared Infiltration and Joining of Advanced Materials" (Applied Technology), R.Y. Lin, S.G. Warrier, C.A. Blue, C.C. Chen, C.A. Eppich, and R.A. Blue, March 1994, pp. 26-30.

"Issues in the Replacement of Lead-Bearing Solders" (Overview), P.T. Vianco and D.R. Frear, July 1993, pp. 14-18.

"Joining Aluminum Materials Using Ultrasonic Impactors" (Innovations in Aluminum, Part I), G. Freitas and M. Dubberly, May 1997, pp. 31, 32.

"Joining Dispersion-Strengthened, Rapidly Solidified, P/M Al Alloys" (Overview), K. Sampath and W.A. Baeslack III, July 1994, pp. 41-47.

"Joining Ductile Refractory Metal Inserts in X-Ray Tube Targets" (Design), M.R. Eggleston, M.R. Jackson, M.G. Benz, and G. Reznikov, January 1996, pp. 59-64.

"Joining ODS Materials for High-Temperature Applications" (Overview), M.G. McKimpson and D. O'Donnell, July 1994, pp. 49-51.

"The Joining of Powder Metallurgy Structural Alloys" (Commentary), M.G. McKimpson, July 1994, p. 40.

"Joining Silicon Nitride to Itself and to Metals" (Overview), S.D. Peteves, G. Ceccone, M. Paulasto, V. Stamos, and P. Yvon, January 1996, pp. 48-52, 74-77.

"Lead-Free Solders and Processing Issues in Microelectronics" (Commentary), Raymond A. Fournelle, June 2003, p. 49.

"Lead-Free Implementation: Reliability, Alloy Development, and New Technology" (Commentary), S. Chada, June 2006, p. 56.

"Lead-Free Solders: Reliability and Other Issues a Year after Legislation" (Commentary), S. Chada, July 2007, pp. 19.

"Lead-Free Solders and Processing Issues Relevant to Microelectronics Packating" (Commentary), R.A. Fournelle, June 2004, p. 33.

"A Lower-Melting-Point Solder Alloy for Surface Mounts" (Research Summary), M.T. McCormack, Y. Degani, H.S. Chen, and W.R. Gesick, May 1996, pp. 54-56.

"Magnesium Alloy Ingots: Chemical and Metallographic Analysis" (Overview), J.M. Tartaglia, J.H.Howard, R.E. Swartz, and R.L. Bentz, Jr., November 2001, pp. 16-19.

"The Material Optimization and Reliability Characterization of an Indium-Solder Thermal Interface Material for CPU Packaging" (Research Summary), C. Deppisch, T. Fitzgerald, A. Raman, F. Hua, C. Zhang, P. Liu, and M, Miller, June 2006, pp. 67-74.

"Materials Challenges in Interconnection: Trade-Offs for Rapid Deployment" (Design), K. Frutschy, Z. Fu, D. Goyal, K. Kinsman, G. Samuelson, and R. Vogt, March 1999, pp. 19-21.

"Materials Issues in Area-Array Microelectronic Packaging" (Overview), D.R. Frear, March 1999, pp. 22–27.

"Measuring the Mechanical Properties of Pb-Free Solder and Sn-Based Intermetallics by Nanoindentation" (Research Summary), R.R. Chromik, R.P. Vinci, S.L. Allen, and M.R. Notis, June 2003, pp. 66-69.

"The Mechanical Behavior of Interconnect Materials for Electronic Packaging" (Research Summary), D.R. Frear, May 1996, pp. 49-53.

"Mechanism and Preventive Measures for Die Soldering during Al Casting in a Ferrous Mold" (Research Summary), Sumanth Shankar and Diran Apelian, August 2002, pp. 47-54.

"A Metallurgical Assessment of SnPbAg Solder for GaAs Power Devices" (Research Summary), J.M. Parsey, Jr., S. Valocchi, W. Cronin, J. Mohr, B.L. Scrivner, and K. Kyler, March 1999, pp. 28-31.

"The Metallurgical Control of Electromigration Failure in Narrow Conducting Lines" (Overview), J.W. Morris, Jr., C.-U. Kim, and S.H. Kang, May 1996, pp. 43-46.

"A Metallurgical Study of Pb-free Solders for Flip Chip Interconnects" (Research Summary), D.R. Frear, J.W. Jang, J.K. Lin, and C. Zhang, June 2001, pp. 28-32, 38.

"Microstructure and Mechanical Properties of Sn-In and Sn-Bi Solders" (Overview), J.W. Morris, Jr., J.L. Freer Goldstein, and Z. Mei, July 1993, pp. 25-27.

"Novel Rare-Earth-Containing Lead-Free Solders with Enhanced Ductility" (Research Summary), M.A. Dudek, R.S. Sidhu, and N. Chawla, June 2006, pp. 57-62.

"The Observation and Simulation of Sn-Ag-Cu Solder Solidification in Chip-Scale Packaging" (Research Summary), K.-S.Kim, K. Suganuma, J.-M. Kim, and C.-W. Hwang, June 2004, pp. 39-43.

"Observations of Nucleation Catalysis Effects during Solidification of SnAgCuX Solder Joints" (Research Summary), I.E. Anderson, J. Walleser, and J.L. Harringa, July 2007, pp. 38-43.

"The Orientation Imaging Microscopy of Lead-Free Sn-Ag Solder Joints" (Research Summary), A.U. Telang and T.R. Bieler, June 2005, pp. 44-49.

"The Oxidation of Lead-Free Sn Alloys by Electrochemical Reduction Analysis" (Research Summary), S. Cho, J. Yu, S.K. Kang, and D.-Y. Shih, June 2005, pp. 50-52.

"Phase Diagrams for Lead-Free Solder Alloys" (Overview), U.R. Kattner, December 2002, pp. 45-51.

"Phase Transformation and Microstructural Evolution in Solder Joints" (Overview), S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu, and C.-C. Chen, January 2007, pp. 39-43.

"Physical Metallurgy in Lead-Free Electronic Solder Development" (Overview), K.N. Subramanian and J.G. Lee, May 2003, pp. 26-32.

"Practical Engineering in TV's Impractical Engineering Shows: Monster Garage and Junkyard Mega-Wars" (The Arts), M. Byko, October 2003, pp. 12-15.

"The Principles and Properties of Thermostat Metals" (Overview), P. Khadkikar, June 1993, pp. 39-42. (Correction printed in August 1993, p. 69.)

"Process Modeling with Neural Networks for Pulsed GMAW Braze Welds" (Research Summary), D. White and J. Jones, September 1997, pp. 49-53.

"The Processing and Evaluation of Clad Metals" (Overview), J.A. Forster, S. Jha, and A. Amatruda, June 1993, pp. 35-38.

"The Processing and Joining of High-Temperature Materials" (Commentary), J.A. Shields, Jr., June 1993, p. 48.

"Progress in the Design of New Lead-Free Solder Alloys" (Overview), M. McCormack and S. Jin, July 1993, pp. 36-40.

"The Properties of Tin-Bismuth Alloy Solders" (Overview), L.E. Felton, C.H. Raeder, and D.B. Knorr, July 1993, pp. 28-32.

"Prototype Analysis of Gravity-Modulated Welding by Inverting Weld Cross Sections" (Research Summary), K.P. Cooper, S.G. Lambrakos, and H.N. Jones III, June 2003, pp. 21-26.

"Public Health and Environmental Benefits of Adopting Lead-Free Solders" (Overview), O.A. Ogunseitan, July 2007, pp. 12-17.

"Reactive Liquid Processing in Ceramic Joining" (Commentary), A. Bronson, February 1999, p. 43.

"Recent Progress in Pb-Free Solders and Soldering Technologies" (Commentary), Sung K. Kang, June 2001, p. 16.

"Recovering Copper Using a Combination of Electrolytic Cells" (Research Summary), Shijie Wang, June 2002, pp. 51-54.

"Refractory Metals and Materials: Joining and Applications" (Commentary), P.R. Subramanian and J.A. Shields, Jr., January 1996, p. 32.

"The Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating" (Research Summary), K. Zeng, R. Stierman, D. Abbott, and M. Murtuza, June 2006, pp. 75-70.

"Simulating Weld-Fusion Boundary Microstructures in Aluminum Alloys" (Research Summary), A.D. Kostrivas and J.C. Lippold, February 2004, pp. 65-72.

"Sn-Ag-Cu and Sn-Cu Solders: Interfacial Reactions with Platnimum" (Research Summary), T.H. Kim and Y.-H. Kim, June 2004, pp. 45-49.

"Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties" (Research Summary), I.E. Anderson, B.A. Cook, J.L. Harringa, and R.L. Terpstra, June 2002, pp. 26-29.

"Solder Engineering for Optoelectronic Packaging" (Overview), Y.C. Lee and N. Basavanhally, June 1994, pp. 46-50.

"Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu Interconnects" (Research Summary), H.Y. Lu, H. Balkan and K.Y.S. Ng, June 2005, pp. 30-35.

"Solidification and Liquidation Cracking Issues in Welding" (Overview), Sindo Kou, June 2003, pp. 37-40.

"Solidification Issues in Welding Research and Practice" (Commentary), K.P. Cooper, June 2003, p. 13.

"Solidification Shrinkage Defects in Electronic Solders" (Overview), G. S. Wable, S.s Chada, B. Neal, and R.A. Fournelle, June 2005, pp. 38-42.

"Solid-Liquid Reactions: The Effect of Cu Content on Sn-Ag-Cu Interconnect" (Research Summary), H.Y. Lu, H. Balkan, and S. Ng, June 2005, pp. 30-35.

"Submicron Particle Chemistry: Vapor Condensation Analogous to Liquid Solidification"(Overview), Neil T. Jenkins and Thomas W. Eagar, June 2003, pp. 44-47.

"A Synchrotron Radiation X-Ray Microdiffraction Study on Orientation Relationships between a Cu₆Sn₅ and Cu Substrate in Solder Joints" (Research Summary), J.L. Suh, K.N. Tu, and N. Tamura, June 2006, pp. 63-66.

"Tin Pest in Sn-0.5wt.% Cu Lead-free Solder" (Research Summary), Yoshiharu Kariya, Naomi Williams, Colin Gagg, and William Plumbridge, June 2001, pp. 39-41.

"Using Visualization to Interpret Solidification Simulations" (Overview), A.F. Giamei and D.E. Edwards, October 1993, pp. 25, 26, 28.

"Weld Analysis Using an Inverse-Problem Approach Based on Quasi-One-Dimensional Interpolation" (Research Summary), S.G. Lambrakos, J.O.Milewski, and P.G. Moore, June 2003, pp. 27-36.

"Welding Company Ponies Up Aluminum in Big Sky Country" (Metallurgraphic), Maureen Byko, August 2001, pp. 12-13.

"Welding: Solidification and Microstructure" (Overview), S.A. David, S.S. Babu, and J.M. Vitek, June 2003, pp. 13-20.