Meeting Resources

World Congress on High Entropy Alloys (HEA 2019)

November 17-20, 2019 • Hyatt at Olive 8 • Seattle, Washington, USA

The World Congress on High Entropy Alloys (HEA 2019) is a new, cross-disciplinary technical forum designed to share the latest research advances in materials with high configurational entropy, including both single-phase and multiphase (compositionally complex) alloys. Scientists and engineers from industry, academia, and government will be convened to facilitate linkages and collaborations on this promising technology, to hopefully lead to widespread application and adoption of these materials.

HEA 2019 will feature highly focused technical talks on topics that include, but are not limited to, fundamental theory of alloy design, computational modeling and simulation, properties, processing, and applications of high entropy alloys. Networking opportunities will also offer attendees a chance to informally discuss the latest developments in high entropy alloys, while also making valuable professional connections.

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Who Will Benefit

Students, postdocs, government and industry research leaders, and academics from across the globe currently studying, using, or potentially interested in the science and engineering of metallic materials and high performance alloys, particularly high entropy alloys.

Congress Sponsors and Organizers

This congress is sponsored by the Structural Materials Division and the Alloy Phases, High Temperature Alloys, and Refractory Metals & Materials Committees, and is being organized by the following individuals:
Chair Daniel Miracle, Air Force Research Laboratory, USA
Co-Chair John J. Lewandowski, Case Western Reserve University, USA
Organizing Team Hyoung Seop Kim, Pohang University of Science and Technology, South Korea
Irene J. Beyerlein, University of California, Santa Barbara, USA
Martin Heilmaier, Karlsruhe Institute of Technology, Germany
Ali Yousefiani, Boeing Research and Technology, USA

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For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

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