Meeting Resources

The 13th International Conference on the Technology of Plasticity

July 26-31, 2020 • The Ohio State University, Ohio Union • Columbus, Ohio, USA

From fundamental science to industrial application, the breadth of the metal forming community will convene at The 13th International Conference on the Technology of Plasticity (ICTP 2020). Scientists and engineers from across industry, academia, and government will share their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups.

Submit an Abstract
Extended Abstract Submission Deadline: August 31, 2019

Who Will Benefit

Students, postdocs, government and industry research leaders, and academics from across the globe currently studying or applying the science and engineering principles of metal forming and shaping.

Conference Sponsors and Organizers

This conference is sponsored by the Materials Processing & Manufacturing Division and the Shaping and Forming Committee, and is being organized by the following individuals:
Lead Organizer Glenn Daehn, The Ohio State University, USA
Local Organizing Committee Elizabeth D. Culley, The Ohio State University, USA
Glenn Daehn, The Ohio State University, USA
Anupam Vivek, The Ohio State University, USA
ICTP 2020 Advisory Committee Jian Cao, Northwestern University, USA
Glenn Daehn, The Ohio State University, USA
Brad Kinsey, University of New Hampshire, USA
Erman Tekkaya, Technical University of Dortmund, Germany
Yoshinori Yoshida, Gifu University, Japan

ICTP 2020 International Scientific Committee

Markus Bambach, BTU Cottbus-Senftenberg (Germany)
Dorel Banabic, Technical University of Cluj-Napoca (Romania)
Francois Bay, Mines ParisTech (France)
Bernd-Arno Behrens, Leibniz Universitat Hannover (Germany)
Alexander Brosius, Technische Universität Dresden (Germany)
Stefania Bruschi, University of Padova (Italy)
Demircan Canadinc, Koç University (Turkey)
Livan Fratini, Università degli Studi di Palermo (Italy)
Andrea Ghiotti, University of Padova (Italy)
Sergey F. Golovashchenko, Oakland University (USA)
Odd Sture Hopperstad, Norwegian University of Science and Technology (Norway)
Hoon Huh, Korea Advanced Institute of Science and Technology (Korea)
Toshihiko Kuwabara, Tokyo University of Agriculture and Technology (Japan)
Mathias Liewald, Universität Stuttgart · Institute for Metal Forming Technology (Germany)
Lukasz Madej, AGH University (Poland)
Ryo Matsumoto, Osaka University (Japan)
Gracious Ngaile, NC State University (USA)
Aleksandr Pesin, Magnitogorsk State Technical University (Russia)
Andrzej Rosochowski, University of Strathclyde Glasgow (U.K.)
Andreas Sterzing, Fraunhofer IWU (Germany)

ICTP Standing Advisory Board

Hiroshi Utsunomiya, Osaka University (Japan)
Pierre-Olivier Bouchard, Mines ParisTech (France)
Julian Allwood, University of Cambridge (UK)
Paolo Bariani, University of Padova (Italy)
Jian Cao, Northwestern University (USA)
Yvan Chastel, Renault (France)
Glenn Daehn, The Ohio State University (USA)
Gerhard Hirt, RWTH Aachen University (Germany)
Peter Groche, TU Darmstadt (Germany)
Hoon Huh, KAIST (S. Korea)
Tak Ishikawa, ISC CHUBU (Japan)
Chung Gil Kang, Pusan National University (Korea)
Manabu Kiuchi, Teikyo Heisei University (Japan)
Jianjun Li, Huazhong University (China)
Martins Paulo, New University of Lisbon (Portugal)
Marion Merklein, Lehrstuhl fur Fertigungstechnologie (Germany)
Ken-Ichiro Mori, Toyohashi University of Technology (Japan)
Rajiv Shivpuri, The Ohio State University (USA)
Erman Tekkaya, Institute für Umformtechnik und Leichtbau (Germany)
Yuan Shijian, Harbin Institute of Technology (China)
Jun Yanagimoto, University of Tokyo (Japan)

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