Upcoming Professional Development Events

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Sunday, March 11, 2018, Phoenix, Arizona

This workshop will address current researches and discuss opportunities and development trends in packaging materials and process, including lead-free solder, alternative interconnects, conductive adhesive, epoxy, substrates, 3D packaging, wafer level packing, quality, reliability, and failure analysis.
TMS is the globally recognized leader for practical, solutions-based professional development courses for the aluminum industry. Starting with the first course in 1995, TMS has partnered with world class experts to develop and deliver aluminum courses that provide the latest tools and techniques for solving current problems and anticipating future challenges. Sign up to receive e-mail updates and learn more about TMS offerings here.