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About the 2001 Electronic Materials Conference



June 27-29, 2001 · 43RD ELECTRONIC MATERIALS CONFERENCE · Notre Dame, Indiana

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The 43rd Electronic Materials Conference (EMC) sponsored by the Electronic Materials Committee of TMS will be held at the University of Notre Dame, Notre Dame, Indiana, from Wednesday, June 27 through Friday, June 29, 2001. The conference provides a forum for topics of current interest and significance on the area of preparation and characterization of electronic materials. Individuals actively engaged or interested in electronic materials research and development are encouraged to attend this meeting, and papers in this general subject area are solicited.

The Electronic Materials technical program will commence at 8:30 AM on Wednesday, June 27. All sessions will be held on grounds at the University of Notre Dame in DeBartolo Hall. The Plenary Session will be located in Washington Hall.

EMC/DRC

The EMC is again being coordinated with the Device Research Conference (DRC) of IEEE, which will be held at the same location, Monday, June 25 through Wednesday, June 27, 2001. This coordination is made in recognition of the strong interaction between electronic materials and device research and should provide for maximum exchange of information between attendees of both conferences. For information regarding the DRC Conference, contact:

Dr. Mark Rodwell
University of California
Department of Electrical and Computer Engineering
Santa Barbara, CA 93106
Tel: 805-893-3244 Fax: 805-893-3262
E-mail: rodwell@ece.ucsb.edu


An On-line View of
The 2001 ELECTRONIC MATERIALS CONFERENCE

VIEW THE ATTENDEES LIST (Downloadable using Adobe Acrobat)
REGISTRATION INFORMATION
The deadline to preregister for the meeting has passed. It is now necessary to register at the meeting site during conference. General information regarding the conference, and a list of general policies is available for on-line review.

TECHNICAL PROGRAM
Final Technical Program (~638 kb) is available in portable document format and can be viewed using Adobe Acrobat. It includes a complete listing of all planned symposia.

ATTENDEE MESSAGE CENTER

  • Telephone: 219-631-6691
  • Fax: 219-631-8083


ALSO OF NOTE

TRAVEL INFORMATION
STUDENT INFORMATION
Student information includes details regarding student awards and the availability of financial assistance.


CORPORATE EXHIBITS & SPONSORSHIP OPPORTUNITIES

PDF FILES FOR DOWNLOAD
Adobe Acrobat is requried for viewing of all PDF files listed below.


LATE NEWS PAPERS

Late news papers will be considered. Authors must submit their abstract by June 1, 2001, using the TMS Conference Management System (CMS). If you have questions or need assistance while using CMS, please contact TMS Technical Programming Services at 724-776-9000 ext. 253. Authors of accepted papers will be notified before the EMC Conference.


2001 EMC CHAIRS
General Chair: Michael R. Melloch, School of Electrical and Computer Engineering, Purdue University, 1285 Elec. Eng. Bldg., West Lafayette, Indiana 47907-1285; telephone: (765) 494-3528; fax: (765) 494-6441; e-mail: melloch@ecn.purdue.edu.

Program Chair: Ilesanmi Adesida, University of Illinois, Department of Electrical and Computer Engineering, 208 N. Wright Street, Urbana, Illinois 61801; telephone: (217) 244-6379; fax: (217) 244-6375; e-mail:
adesida@capone.ccsm.uiuc.edu.


Local Arrangements Chair: Douglas C. Hall, University of Notre Dame, Electrical Engineering, 260 Fitzpatrick Hall, Notre Dame, IN 46556-5637; telephone: (219)631-8631; fax: (219)631-4393; e-mail: dhall@nd.edu

ELECTRONIC MATERIALS COMMITTEE OFFICERS

Michael Melloch
Chairman
Purdue University

Thomas Kuech
Past Chairman
University of Wisconsin

Ilesanmi Adesida
Vice Chairman
University of Illinois

April Brown
Treasurer
Georgia Institute of Technology

Raymond Tsui
Secretary
Motorola Inc

Ted Harman
Editor-JEM
Massachusetts Institute of Technology

Robert Shull
Director/Chair EPD
NIST


ELECTRONIC MATERIALS COMMITTEE MEMBERS

Carol Ashby, Sandia National Labs; Dieter Bimberg, Technical University of Berlin; Leonard Brillson, Ohio State University; Daniel Dapkus, University of Southern California; L. Ralph Dawson, University of New Mexico; Russell D. Dupuis, University Texas, Austin; Randall M. Feenstra, Carnegie Mellon University; Mark Goorsky, University of California, Los Angeles; Julia Hsu, Lucent Technologies, Bell Labs; Evelyn L. Hu, University of California, Santa Barbara; David Janes, Purdue University; Lionel C. Kimerling, Massachusetts Institute of Technology; Kei-Mai Lau, Hong Kong University of Science & Technology; Theresa Mayer, Pennsylvania State University; James L. Merz, University of Notre Dame; Richard H. Miles, SDL Inc; Laura Mirkarimi, Agilent Labs; Suzanne Mohney, Pennsylvania State University; Masanori Murakami, Kyoto University; Laura S. Rea, Wright Patterson Air Force Base; Joan Redwing, Pennsylvania State University; Steve Ringel, Ohio State University; Ben Shanabrook, Naval Research Lab; James Speck, University of California, Santa Barbara; Michael Spencer, Cornell University; Steve Stockman, LUMILEDS; Dwight Streit, TRW Inc; Mike Tischler, ATMI; Charles Tu, University of California, San Diego; Jerry M. Woodall, Yale University; Edward Yu, University of California, San Diego


INVITED ORGANIZERS
Supriyo Bandyopadhayay, University of Nebraska; Ishwara Bhat, Rensselaer Polytechnic Institute; Robert Biefeld, Sandia National Labs; Mike Capano, Purdue University; Shigefusa Chichibu, University of Tsukuba; Supriyo Datta, Purdue University; Steve Denbaars, University of California, Santa Barbara; Ananth Dodabalapur, Lucent Technologies, Bell Labs; Charles R. Eddy, Jr., Boston University; Kurt Eyink, Wright Patterson Air Force Base; Eugene Fitzgerald, Massachusetts Institute of Technology; Jacek Furdyna, University of Notre Dame; Arthur Gossard, University of California, Santa Barbara; Louis Guido, Virginia Tech; Karl Hobart, Naval Research Lab; Andrew D. Johnson, DERA; P. Lenahan, Pennsylvania State University; Marya Lieberman, University of Notre Dame; T.P. Ma, Yale University; George Malliaras, Cornell University; George Maracas, Motorola BioChip Systems; Mark Miller, University of Utah; Laura Mirkarimi, Agilent Labs; Peter D. Moran, University of Wisconsin, Madison; M. Murakami, Kyoto University; Thomas Myers, West Virginia University; Phil Neudeck, NASA Glenn Research Center; Chris Palmstrom, University of Minnesota; Fred Pollak, Brooklyn College of CUNY; Lisa Porter, Carnegie Mellon University; John A. Roth, HRL Laboratories, LLC; Robert Sacks, Picometrix Inc; Hiroyuki Sakaki, University of Tokyo; Akio Sasaki, Osaka Electro-Communication University; Matthew Seaford, RF Micro Devices; T.-Y. Seong, Kwangju Institute of Science & Technology; Marek Skowronski, Carnegie Mellon University; Dwight Streit, TRW; Gerald Stringfellow, University of Utah; James Sturm, Princeton University; Saied Tehrani, Motorola; Henryk Temkin, Texas Tech University; Michael Tischler, ATM;I Robert Vaudo, ATMI; Kang Wang, University of California, Los Angeles; Bruce Wessels, Northwestern University; Christian Wetzel, Uniroyal Optoelectronics; Lloyd J. Whitman, Naval Research Lab; Carl-Mikael Zetterling, KTH, Royal Institute of Technology


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