Meeting Resources

World Congress on High Entropy Alloys (HEA 2019)

November 17-20, 2019 • Hyatt at Olive 8 • Seattle, Washington, USA

Online and advanced registration is now closed

Onsite registration is available beginning at 5:00p.m. on, November 17th in the Ballroom Foyer, at the Hyatt at Olive 8. To expedite the registration process, you may complete and print the PDF registration form and bring it with you. TMS staff will be available to assist you with your registration.

The World Congress on High Entropy Alloys (HEA 2019) is a new, cross-disciplinary technical forum designed to share the latest research advances in materials with high configurational entropy, including both single-phase and multiphase (compositionally complex) alloys. HEA 2019 will feature highly focused technical talks on topics that include, but are not limited to, fundamental theory of alloy design, computational modeling and simulation, properties, processing, and applications of high entropy alloys.

Networking opportunities will also offer attendees a chance to informally discuss the latest developments in high entropy alloys, while also making valuable professional connections. The congress will attract research leaders from industry, government, and academics from across the globe, as well as students and postdocs interested in the science and engineering of metallic materials and high performance alloys. Scientists and engineers will be convened to facilitate linkages and collaborations on this promising technology, to hopefully lead to widespread application and adoption of these materials.

Thank You to Our Sponsors

Registration Awards

TMS received funding support to facilitate HEA 2019 attendance by students, postdoctoral researchers, and early-career investigators. Successful applicants received free registration which includes access to:

  • All technical sessions
  • Sunday evening welcome reception
  • Refreshment breaks during session intermissions
  • Tuesday dinner event

Please visit the HEA 2019 Registration Award Application form to submit your application. Applications must be submitted by November 1. Successful applicants will be notified by TMS staff.

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Congress Sponsors and Organizers

This congress is sponsored by the Structural Materials Division and the Alloy Phases, High Temperature Alloys, and Refractory Metals & Materials Committees, and is being organized by the following individuals:
Chair Daniel Miracle, Air Force Research Laboratory, USA
Co-Chair John J. Lewandowski, Case Western Reserve University, USA
Organizing Team Irene J. Beyerlein, University of California, Santa Barbara, USA
Martin Heilmaier, Karlsruhe Institute of Technology, Germany
Hyoung Seop Kim, Pohang University of Science and Technology, South Korea
Ali Yousefiani, Boeing Research & Technology, USA

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770