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Electronic MaterialsTMS 2009: Electronic Materials Program
February 15-19, 2009 • San Francisco, California

In recent years, the field of electronic materials has had to adapt to new environmental regulations and address end-of-life issues in concert with advances in materials and process technologies. At the TMS 2009 Annual Meeting, five symposia are planned in areas related to electronic materials developments, as well as a special networking reception for those working with lead-free solders and several related short courses.

PLANNED SYMPOSIA

The Electronic Materials 2009 program will include the following symposia:

  • Pb-Free Solders and Emerging Interconnect and Packaging Technologies
    Emerging interconnect and packaging technologies will be discussed at this symposium as well as insights provided into existing materials and technologies. [MORE]
  • Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VIII
    This symposium will address the stability, transformation and formation of phases during the fabrication, processing and utilization of electronic materials and devices. [MORE]
  • Recent Advances in Thin Films
    Presentations in this symposium will cover thin films, ferroelectrics, piezoelectric ceramics, magnetoelectric composites, microscopic characterization, and modeling and simulation of behavior. [MORE]
  • Recycling of Electronic Wastes
    Learn about various aspects of recycling electronic wastes, including mechanical recycling, plastics recycling, metals recovery, hydrometallurgical recycling (leaching), combustion or pyrolysis, and life cycle and economic analysis. [MORE]
  • General Abstracts:  Electronic, Magnetic, and Photonic Materials Division
    Presentations cover subjects such as alloy phases, biomaterials, electronic materials, energy, magnetic materials, nanomaterials, and thin films. [MORE]

RELATED EVENTS

Short Courses
Plan on attending one of these practical short courses or workshops! Visit the Short Courses web page for a complete list of courses being offered.

  • Green Materials and Processes for Managing Electronic Waste
    The major economic driver for recycling of electronic waste in industry is from the recovery of precious metals. [MORE]
  • Lead-Free Solders Workshop
    This workshop is organized to serve as the industry roadmap for Pb free solders in high reliability packaging and interconnections, with current industry needs and concerns serving as a driving force for research. [MORE]

Special Events

  • Lead-Free Solders Networking Reception
    Join colleagues and meet other attendees with an interest in lead-free solders, from 6 to 8 p.m. on Sunday, February 15, to view posters and network. 

RELATED PROCEEDINGS


For more information on these or additional proceedings, please visit the Proceedings page.

  • EPD Congress 2009

  • Supplemental Proceedings Volume 3: General Paper Selections

PROGRAM HIGHLIGHTS
Learn about the research, applied practices and networking events planned in these key technical areas:

ALUMINUM

COMPUTATIONAL MATERIALS SCIENCE & ENGINEERING

ELECTRONIC MATERIALS

EMERGING MATERIALS

MAGNESIUM

MATERIALS AND SOCIETY

MATERIALS CHARACTERIZATION

MATERIALS PROCESSING

NANOTECHNOLOGY


PROGRAM DOWNLOADS
The following are PDF downloads of the final program:

PROGRAM AT-A-GLANCE

SUNDAY/MONDAY PROGRAM

TUESDAY PROGRAM

WEDNESDAY PROGRAM

THURSDAY/POSTER SESSION

COMPLETE FINAL PROGRAM

PROGRAM INDEX

PERSONAL CONFERENCE SCHEDULER:
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