43rd Electronic Materials Conference (EMC) sponsored
by the Electronic Materials Committee of TMS will
be held at the University of Notre
Dame, Notre Dame, Indiana, from Wednesday, June 27 through Friday, June
29, 2001. The conference provides a forum for topics of current interest and
significance on the area of preparation and characterization of electronic materials.
Individuals actively engaged or interested in electronic materials research
and development are encouraged to attend this meeting, and papers in this general
subject area are solicited.
The EMC is again being coordinated with the Device Research Conference (DRC) of IEEE, which will be held at the same location, Monday, June 25 through Wednesday, June 27, 2001. This coordination is made in recognition of the strong interaction between electronic materials and device research and should provide for maximum exchange of information between attendees of both conferences.
The deadline to register in advance for the meeting has passed. To attend, it is now necessary to register at the meeting site. On-site registration will be located in McKenna Hall and will begin on Tuesday afternoon continuing Wednesday morning through Friday morning during the following hours:
Tuesday, June 26
3:00 PM–5:00 PM
Wednesday, June 27
7:30 AM–5:00 PM
Thursday, June 28
7:30 AM–4:00 PM
Friday, June 29
7:30 AM–10:00 AM
Become a TMS Member! TMS addresses the issues in Electronic Materials.
All TMS members receive discounted pricing on meetings, publications, and short
courses. Members also receive a complimentary subscription to JOM,
the highly respected society journal, and access to the TMS Membership Directory
available on TMS OnLine.
To join today, complete and submit the TMS membership application. For more information, contact:
Telephone: 724-776-9000, ext. 221
The Electronic Materials Conference technical program commences at 8:20 AM on Wednesday, June 27. All sessions are held on grounds of the University of Notre Dame in DeBartolo Hall. The Plenary Session is located in Washington Hall.
There are no formal conference proceedings. The conference abstracts will be included in the technical program and published in the July issue of the Journal of Electronic Materials (JEM). We also encourage you to submit manuscripts of your work to JEM.
There are no formal conference proceedings, but the conference abstracts will
be published in the Journal
of Electronic Materials (JEM). We also encourage you to submit
manuscripts on your work to JEM.
JEM, a monthly
archival publication of TMS and the Institute
of Electrical and Electronics Engineers (IEEE), was created to serve as
the publication of the Electronic Materials Conference.
Throughout the year, JEM
publishes selected papers presented at the Electronic Materials
Conference, and welcomes the submission of related electronic materials
The journal contains technical papers detailing critical new developments in the electronics field, as well as invited and contributed review papers on topics of current interest, designed to enable those in the field of electronics to keep abreast of activities in areas vital to their own technical interests.
Articles that appear in JEM are reviewed, selected, and edited by peers in the field who serve as voluntary members of the editorial board or the board of associate editors or as section editors. Generally, they are members of the Electronic Materials Committee of TMS or are members of IEEE.
Theodore C. Harman
Massachusetts Institute of Technology
244 Wood Street
Lexington, MA 02420-9108
Detailed manuscript submission guidelines are available from the
JEM Subscription Information
The Journal of Electronic Materials acts as a forum for the rapid circulation of the results of original research, enabling those in the electronic materials field to keep abreast of activities peripheral to their own. The journal focuses on electronic memory and logic structures, magnetic-optical recording media, superlattices, packaging, detectors, emitters, metallization technology, superconductors, and low thermal-budget processing and includes general papers on electronic materials for device application, structure making, reliability and yield. Articles on methods for preparing and evaluating the chemical, physical, and electronic properties of electronic materials are also included.
JEM subscriptions are available in both print and electronic formats. In addition to receiving on-line access to the current issues of the journal, electronic subscribers have unlimited access to past journal issues with their subscription.
TMS and IEEE members receive significant discounts on JEM subscriptions. See the registration form to subscribe to JEM along with registration fees. Individual issues of the journal may also be purchased through the TMS Document Center for $15 a copy, plus shipping or contact TMS Subscriptions Representative, Mark Cirelli, at the following address.
184 Thorn Hill Road
Warrendale, PA 15086
Telephone: 724-776-9000, ext. 251
Refund Policy: The deadline for all refunds was June 4, 2001. No refunds
will be issued at the meeting. All fees and tickets are non-refundable after
the June 4, 2001, deadline.
Americans with Disabilities Act: TMS strongly supports the federal Americans with Disabilities Act (ADA), which prohibits discrimination against, and promotes public accessibility for those with disabilities. In support of and compliance with this Act, we ask that those attendees of EMC requiring specific equipment or services indicate their needs in advance at the EMC Registration Desk.
Policy on Audio and Visual Recording of Technical Paper Presentations/Sessions: TMS reserves the rights to any audio and video reproduction of all presentations at every TMS sponsored meeting. Recording of sessions (audio, video, still photography, etc.) intended for personal use, distribution, publication, or copyright without the express written consent of TMS and the individual authors is strictly prohibited.
|Search||43rd EMC||59th DRC||Conference Management System||TMS Meetings Page||TMS OnLine|