The conference will provide a forum for topics of current interest and significance in the areas related to the preparation and characterization of electronic materials. Individuals actively engaged or interested in electronic materials research and development are encouraged to attend this meeting.
THE 41st ELECTRONIC MATERIALS CONFERENCE
ABOUT SANTA BARBARA
TRAVEL AND DESTINATION INFORMATION
HOUSING ACCOMMODATIONS INFORMATION
COMPLETE AT-MEETING TECHNICAL PROGRAM IN .PDF FORMAT: Updated on May 25th to include abstracts, a program grid, author index, and "meeting at a glance" section. (Downloadable using Adobe Acrobat)
ADVANCE MAILER IN .PDF FORMAT (Downloadable using Adobe Acrobat)
PUBLICATION OF PAPERS
JOHN BARDEEN AWARD
CAR RENTAL INFORMATION
|1999 EMC CHAIRS|
General Chair: Thomas Kuech, University of Wisconsin, Department of Chemical Engineering, 1415 Johnson Drive, Madison, WI 53706; telephone (608) 263-2922; fax (608) 265-3782; e-mail email@example.com.
Program Chair: Michael R. Melloch, School of Electrical and Computer Engineering, Purdue University, 1285 Elec. Eng. Bldg., West Lafayette, IN 47907-1285; telephone (765) 494-3528; fax (765) 494-6441; e-mail firstname.lastname@example.org.
|INVITED ORGANIZERS FOR THE 1999 EMC|
|Carol Ashby, Sandia National Labs; Supriyo Bandyopadhayay, University of Nebraska; Ishwara Bhat, Rensselaer Polytechnic Institute; Thomas F. Boggess, University of Iowa; Len Brillson, Ohio State University; Mike Capano, Purdue University; Greg Charache, Lockheed Martin; Shigefusa Chichibu, Science University of Tokyo; Tim Coutts, NREL; P. Daniel Dapkus, University of Southern California; Steve Denbaars, University of California, Santa Barbara; Daniel P. Docter, HRL Laboratories; Kurt Eyink, Wright Patterson Air Force Base; Mark S. Goorsky, University of California, Los Angeles; Robert J. Hamers, University of Wisconsin; Marian Hargis, Mellwood Laboratories; Julia Hsu, University of Virginia; David Janes, Purdue University; Andrew D. Johnson, DERA; Theresa Mayer, Pennsylvania State University; Paul McIntyre, Stanford University; Mark Miller, University of Virginia; Suzanne Mohney, Pennsylvania State University; Karen Moore, Motorola, Inc.; Peter D. Moran, University of Wisconsin-Madison; Shelby Nelson, University of Wisconsin-Madison; Gerhard Pensi, University of Erlangen; Lisa Porter, Carnegie Mellon University; Laura Rae, United States Department of Defense; Joan Redwing, Epitronics; Steven A. Ringel, Ohio State University; Jeff Rosner, Hewlett-Packard Laboratories; John A. Roth, HRL Laboratories, LLC; Huub Salemink, IBM Research; Werner Seifert, University of Lund; Ben Shanabrook, Naval Research Labs; Marek Skowronski, Carnegie Mellon University; Steven Streiffer, Argonne National Laboratory; Dwight Streit, TRW; Gerald Stringfellow, University of Utah; Paul Thibaldo, University of Arkansas; Clivia M. Sotomayor Torres, University of Wuppertal; Charles Tu, University of California, San Diego; Parvez Uppal, Sanders, Lockheed Martin; Christian Wetzel, Meijo University|
|ELECTRONIC MATERIALS COMMITTEE|
|OFFICERS: Thomas Kuech, Chair, University of Wisconsin; Timothy Sands, Past Chair, University of California, Berkeley; Michael Melloch, Vice Chair, Purdue University; Eugene Fitzgerald, Secretary, Massachusetts Institute of Technology; Ilesanmi Adesida, Treasurer, University of Illinois; Ted C. Harman, JEM editor, Massachusetts Institute of Technology, Lincoln Laboratory; John M. Parsey, JOM advisor, Motorola, Inc.; Robert Schull, Chair, EMPMD, NIST MEMBERS: Robert Biefeld, Sandia National Laboratories; Dieter Bimberg, Technical University, Berlin; April Brown, Georgia Institute of Technology; Constance Chang-Hasnain, University of California, Berkeley; L. Ralph Dawson, University of New Mexico; Russell D. Dupuis, University of Texas, Austin; Randall M. Feenstra, Carnegie Mellon University; Evelyn L. Hu, University California-Santa Barbara; Vassilis Keramidas, Bellcore; Lionel C. Kimerling, Massachusetts Institute of Technology; Leslie A. Kolokziejski, Massachusetts Insitutue of Technology; James Merz, University of Notre Dame; Richard H. Miles, SDL, Inc.; Theodore D. Moustakas, Boston University; Diego J. Olego, Phillips Laboratories; Fred H. Pollak, Brooklyn College of City University of New York; Akio Sasaki, Osaka Electro-Communication University; James S. Speck, University of California, Santa Barbara; Michael G. Spencer, Howard University; Gregory E. Stillman, University of Illinois; Steve Stockman, Hewlett-Packard Co.; James C. Sturm, Princeton University; Michael Tischler, Epitronics Corporation; Ray Tsui, Motorola, Inc.; Kang L. Wang, University of California-Los Angeles; Bruce W. Wessels, Northwestern University; Laura Ann Wills, Hewlett-Packard Co.; Jerry M. Woodall, Purdue University; Eli Yablanovitch, University of California, Los Angeles; Edward Yu, University of California-LaJolla; Alex Zunger, NREL|
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