Note: This conference was originally planned for 2020 and is now scheduled for 2021.
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TMS is closely monitoring the situation related to COVID-19 and is taking steps to address concerns that may arise regarding attendance. See the Health & Safety section for details.
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Johns Hopkins University, USA
Presentation Title: "Acoustic Emission Measurements of Damage Accumulation and Crack Initiation in Metals at the Micron-scale"
Kyushu University, Japan
Presentation Title: "Toward Dynamic 3D Visualization of Dislocations by Electron Tomography"
Helena Van Swygenhoven
Paul Scherrer Institute & Swiss Federal Institute of Technology Lausanne, Switzerland
Presentation Title: "Operando and Insitu Synchrotron Experiments Following Microstructural Evolutions"
Learn more about the technical program.
Congress Sponsors and Organizers
This congress is sponsored by the TMS Structural Materials Division (SMD)
and the Advanced Characterization, Testing, and Simulation Committee
, and is being organized by the following committee of individuals:
||Dorte Juul Jensen, Technical University of Denmark, Denmark
||Erica Lilleodden, Helmholtz-Zentrum Geesthacht, Germany
Scott Barnett, Northwestern University, USA
Keith Knipling, Naval Research Laboratory, USA
Matthew P. Miller, Cornell University, USA
Akira Taniyama, Nippon Steel, Japan
Hiroyuki Toda, Kyushu University, Japan
Lei Zhang, Chinese Academy of Sciences, China
For More Information
For more information about this meeting, please complete the meeting inquiry form or contact:
TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000, ext. 241