Meeting Resources
3rd World Congress on High Entropy Alloys (HEA 2023)

November 12–15, 2023

Omni William Penn Hotel • Pittsburgh, Pennsylvania, USA

Final Program

Registration is now closed.

This meeting took place from November 12–15, 2023. Please Please join the e-mail list to receive updates about future HEA congresses.

The 3rd World Congress on High Entropy Alloys (HEA 2023) is a cross-disciplinary technical forum designed to share the latest research advances in single-phase and multiphase metallic, intermetallic, and ceramic high entropy materials for functional or structural applications. HEA 2023 will feature highly focused technical talks on topics that include, but are not limited to, fundamental theory of alloy design, computational modeling and simulation, properties, processing, and applications of high entropy alloys.

Networking opportunities will also offer attendees a chance to informally discuss the latest developments in high entropy alloys, while also making valuable professional connections. The congress will attract research leaders from industry, government, and academia from across the globe, as well as students and postdocs interested in the science and engineering of metallic materials and high-performance alloys. Scientists and engineers will be convened to facilitate linkages and collaborations on this promising technology, to hopefully lead to widespread application and adoption of these materials.

Thank You to Our Sponsors

Boeing calnano Thermo-Calc Exotech American Elements Boeing calnano Thermo-Calc Exotech American Elements

Abstract Submission Extended Deadline:
June 30, 2023

Discount Registration Deadline:
September 27, 2023

Housing Deadline:
October 18, 2023

Congress Dates:
November 12–15, 2023

Journal Submission Extended Deadline:
March 31, 2024

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Congress Sponsors and Organizers

This conference is sponsored by the Structural Materials Division, Mechanical Behavior of Materials Committee, Alloy Phases Committee, and High Temperature Alloys Committee and is being organized by the following individuals:
Chair Andrew Detor, DARPA, USA
Programming Chair
Organizing Committee
Amy Clarke, Los Alamos National Laboratory, USA
Martin Heilmaier, Karlsruhe Institute of Technology, Germany
Keith Knipling, Naval Research Laboratory, USA
Elizabeth Opila, University of Virginia, USA
Oleg N. Senkov, MRL Materials Resources LLC and Air Force Research Laboratory, USA
C. Cem Tasan, Massachusetts Institute of Technology, USA
Mike Titus, Purdue University, USA

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For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
U.S. and Canada Only: 1-800-759-4867
Other Countries: 1-724-776-9000
Fax: 1-724-776-3770