Sn-Whisker Formation in Pb-Free Solders
Live Event Date and Time: Thursday, August 25, 2016 • 9:00 a.m. to 10:00 a.m. (EDT)
Instructors: Eric Chason, Brown University, and Carol Handwerker, Purdue University
Moderator: Andre Delhaise, University of Toronto
This webinar will discuss the up-to-date knowledge of the phenomenon of tin whiskering in solder joints. The various causes for tin whisker nucleation and growth will be covered, as well as common techniques for mitigation. Modifications to solder joints and alloys will also be covered, along with the effects of these modifications on mitigations of whisker growth. Finally, an overview of the modelling of tin whisker growth will be given.
The goal of this webinar is to provide the audience a foundational understanding of the initiation of tin whisker growth and mitigation techniques, to introduce and define common terminology within the field, and to project the future of tin whisker research in the electronics industry in an effort to improve product reliability.
Meet the Instructors
Eric Chason is a professor in the School of Engineering at Brown University. His research focuses primarily on the evolution of surfaces and thin films during materials processing. This work has led to the development of several in situ diagnostics that enable the monitoring of thin film stress surface morphology, microstructure, and interfacial reactions. This includes the development of a multi-beam optical technique (MOSS) for monitoring stress evolution in situ during processing. Recent projects include residual stress in polycrystalline films, whisker formation in Sn, anodes for Li-ion batteries, and ion-induced surface nano-patterning. Before moving to Brown in 1998, Chason was a senior member of the technical staff at Sandia National Laboratories. He received his Ph.D. in physics in 1985 from Harvard University.
Carol Handwerker is the Reinhardt Schuhmann Jr. Professor of Materials Engineering, and Environmental and Ecological Engineering at Purdue University. Her research program is focused on materials design and the prediction and control of microstructure evolution in a wide range of applications. With respect to Pb-free electronics, Handwerker has been working closely with the consumer electronics, automotive, defense, and aerospace industries in the transition to Pb-free materials and processes since 1994, first at the National Institute of Standards and Technology (NIST) and now at Purdue. She has been involved with projects for the International Electronics Manufacturing Initiative (iNEMI) since 1999, including as co-leader of the Pb-free Alloy Selection Team in the Pb-free Electronics Project; as a member of the Tin Whisker Fundamentals Project; as co-chair of the Metals Recycling Project; and currently as a co-chair of the Project on Value Recovery from End-of-Life Electronics. She also serves on the iNEMI Environmental Leadership Steering Committee, which focuses on meaningful improvements in the global economic, environmental, and societal sustainability of electronics. Additionally, Handwerker served as PI and director of the Purdue University-Tuskegee University National Science Foundation (NSF) Integrative Graduate Education and Research Traineeship (IGERT) in Sustainable Electronics from 2012 to 2015.
The live webinar was held on August 25, 2016, but the recording is still available for purchase. Upon registering, event details and link will be provided in a separate e-mail. Register today for this four-part webinar series:
(Live event or recorded event)
* Must be a full-time undergraduate or graduate student to receive the student rate; a copy of student school identification card is required; must e-mail a copy of ID card to TMS Meeting Services upon registering.
CANCELLATION/REFUND POLICY: TMS reserves the right to cancel this webinar due to low registration; registrants will be notified at least 24 hours prior to the start of the live event and will receive a full refund. If a registrant must cancel, TMS must be notified in writing (by e-mail or mail) before August 11, 2016; payment will be refunded less a $20 processing fee. No refunds will be processed after August 11, 2016.
This four-part webinar series is sponsored by the TMS Functional Materials Division (FMD) and Electronic Packaging & Interconnection Materials Committee.
Thank you to the corporate sponsors of the Electronic Packaging and Interconnect Webinar Series: