Tae-Kyu Lee is an associate professor at Portland State University. Before joining the Department of Mechanical and Materials Engineering in 2015, he worked as a senior engineer in Cisco’s Component Quality and Technology (CQT) Group, Packaging and Interconnect Technology Team. He is working on board-level interconnect reliability, next generation packaging technology, macro to micro joining technology, and solder/welding joint material characterizations. He also worked as a postdoctoral fellow at Lawrence Berkeley National Laboratory before joining Cisco. Lee received his Ph.D. in materials science and engineering from the University of California, Berkeley on studies related to high-temperature superconducting quantum interference device (SQUID) non-destructive evaluation. He is actively involved in several industry consortia and as a lead organizer for the TMS Lead-Free Solder Technology Workshop for the last five years. Lee is also the current vice chair of the TMS Electronic Packaging & Interconnection Materials Committee and an associate editor for TMS’s Journal of Electronic Materials.

Yan Li is currently a senior staff packaging engineer in the Assembly Test and Technology Development Failure Analysis Lab at Intel Corporation. She joined Intel in 2006, and currently focuses on the quality and reliability of electronic packages, fundamental understanding of failure modes and failure mechanisms of electronic packages, and developing new tools and techniques for fault isolation and failure analysis of electronic packages. Li received her Ph.D. in materials science and engineering from Northwestern University in 2006 on studies related to the synthesis and characterization of boron-based nanowires and nanotubes. She is actively involved in professional associations, such as TMS, ASM International, and the Electronic Device Failure Analysis Society (EDFAS), serving each as a conference organizer and session chair for more than five years.