Microelectronics Packaging and Design 101 Webinar
Live Event Date and Time: Thursday, August 18, 2016 • 9:00 a.m. to 10:00 a.m. (EDT)
Instructors: Tae-Kyu Lee, Portland State University, and Tan Li, Intel
Corporate Sponsorship: Nihon Superior Co., Ltd. And Thermo-Calc Software
Moderator: Kathlene Reeve, Purdue University
This webinar will discuss past, present, and upcoming microelectronic packaging designs. Fundamental aspects of microelectronic packaging will be overviewed in terms of solder joint design within packaging architectures. An emphasis on the different soldering attachment techniques including metallization methods, solder application, fluxing, and reflow processing will be given. The goal of the webinar will be to provide the audience with a foundational understanding of solder joint design within microelectronics packaging, to introduce and define common terminology within the field, and to project the future of solder joint design within upcoming microelectronic systems.
Meet the Instructors
Tae-Kyu Lee is an associate professor at Portland State University. Before joining the Department of Mechanical and Materials Engineering in 2015, he worked as a senior engineer in Cisco’s Component Quality and Technology (CQT) Group, Packaging and Interconnect Technology Team. He is working on board-level interconnect reliability, next generation packaging technology, macro to micro joining technology, and solder/welding joint material characterizations. He also worked as a postdoctoral fellow at Lawrence Berkeley National Laboratory before joining Cisco. Lee received his Ph.D. in materials science and engineering from the University of California, Berkeley on studies related to high-temperature superconducting quantum interference device (SQUID) non-destructive evaluation. He is actively involved in several industry consortia and as a lead organizer for the TMS Lead-Free Solder Technology Workshop for the last five years. Lee is also the current vice chair of the TMS Electronic Packaging & Interconnection Materials Committee and an associate editor for TMS’s Journal of Electronic Materials.
Yan Li is currently a senior staff packaging engineer in the Assembly Test and Technology Development Failure Analysis Lab at Intel Corporation. She joined Intel in 2006, and currently focuses on the quality and reliability of electronic packages, fundamental understanding of failure modes and failure mechanisms of electronic packages, and developing new tools and techniques for fault isolation and failure analysis of electronic packages. Li received her Ph.D. in materials science and engineering from Northwestern University in 2006 on studies related to the synthesis and characterization of boron-based nanowires and nanotubes. She is actively involved in professional associations, such as TMS, ASM International, and the Electronic Device Failure Analysis Society (EDFAS), serving each as a conference organizer and session chair for more than five years.
The live webinar was held on August 18, 2016, but the recording is still available for purchase. One registration fee will give you access to all four webinars in the series.. Upon registering, event details and link will be provided in a separate e-mail. Register today for this four-part webinar series:
(Live event or recorded event)
* Must be a full-time undergraduate or graduate student to receive the student rate; a copy of student school identification card is required; must e-mail a copy of ID card to TMS Meeting Services
CANCELLATION/REFUND POLICY: TMS reserves the right to cancel this webinar due to low registration; registrants will be notified at least 24 hours prior to the start of the live event and will receive a full refund. If a registrant must cancel, TMS must be notified in writing (by e-mail or mail) before August 11, 2016; payment will be refunded less a $20 processing fee. No refunds will be processed after August 11, 2016.
This four-part webinar series is sponsored by the TMS Functional Materials Division (FMD) and Electronic Packaging & Interconnection Materials Committee.
Thank you to the corporate sponsors of the Electronic Packaging and Interconnect Webinar Series: