Electronic Packaging and Interconnect Materials Webinar Series - Webinar 3
Intermetallic Formation in Pb-Free Solders
Live Event Date and Time: Thursday, September 1, 2016 • 9:00 a.m. to 10:00 a.m. (EDT)
Instructors: Christopher Gourlay, Imperial College London, and Kazuhiro Nogita, University of Queensland
Moderator: Arif Mohd Salleh, University of Queensland
Technical Scope

This webinar will offer an overview regarding the understanding of intermetallic formations in Pb-free solder joints, as well as a review of recent investigations into the manipulation of intermetallic formations for improved solder performance. The fundamentals of primary and interfacial intermetallic formations during early stage of nucleation and subsequent growth in various Pb-free solder joints will be highlight. The goal of the webinar will be to provide the audience with a foundational understanding of intermetallic formations in various Pb-free solder joints and to emphasize the importance of intermetallic formation and manipulation on the performance and reliability of Pb-free solder joints.

Meet the Instructors

Christopher Gourlay is a reader in solidification processing at Imperial College London. He read metallurgy at the University of Oxford (M.Eng., 2002) and the University of Queensland (Ph.D., 2007). His research focuses on microstructure formation in solders and in light alloy castings. Gourlay is currently a JOM advisor for the Electronic Packaging and Interconnection Materials Committee, and co-organized the Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology for the TMS 2016 Annual Meeting & Exhibition. He is also an associate editor of the Journal of Crystal Growth.

Kazuhiro Nogita graduated as an engineer in Japan in 1990 and worked in the nuclear power industry with Hitachi Ltd. He was awarded a Ph.D. from Kyushu University in 1997. He migrated to Australia in 1999 after accepting a position at the University of Queensland, where he became the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) in July 2012. He is also an invited/visiting professor at Kyushu University and the University of Malaysia Perlis. His research is in three major areas, namely, lead-free solders, hydrogen-storage alloys, and light metals. Nogita holds 10 international patents and has authored more than 150 refereed scientific papers. He has been participating in the World Solar Challenge, the largest solar car race, as a member of TeamArrow.


The live webinar was held on September 1, 2016, but the recording is still available for purchase. Upon registering, event details and link will be provided in a separate e-mail. Register today for this four-part webinar series:

Registration Rates:
(Live event or recorded event)

  Member Nonmember
Standard Rate $60 $80
Student Rate* $30 $30
Group Rate $180 $180
* Must be a full-time undergraduate or graduate student to receive the student rate; a copy of student school identification card is required; must e-mail a copy of ID card to TMS Meeting Services upon registering.

CANCELLATION/REFUND POLICY: TMS reserves the right to cancel this webinar due to low registration; registrants will be notified at least 24 hours prior to the start of the live event and will receive a full refund. If a registrant must cancel, TMS must be notified in writing (by e-mail or mail) before August 11, 2016; payment will be refunded less a $20 processing fee. No refunds will be processed after August 11, 2016.


This four-part webinar series is sponsored by the TMS Functional Materials Division (FMD) and Electronic Packaging & Interconnection Materials Committee.

Thank you to the corporate sponsors of the Electronic Packaging and Interconnect Webinar Series: