Electronic Packaging and Interconnection Materials Committee

JOM Topics

The following topics appear in recent issues of JOM under the sponsorship of our committee.

There are currently no topics at this time. Check back later.

Past Topics

Topics no longer accepting submissions

Topic Title: Advanced Technology for Electronic Packaging and Interconnection Materials

Publication Date: June 2024

Topic Title: Advanced Technology for Electronic Packaging and Interconnection Materials

Publication Date: June 2023

Topic Title: Low-temperature Technology for Electronic Packaging and Interconnects

Publication Date: May 2022

Topic Title: Materials for High Reliability Devices

Publication Date: February 2021

Topic Title: Progress with Lead-Free Solders

Publication Date: February 2020

Topic Title: Advances in Electronic Interconnection Materials

Publication Date: January 2019

RESOURCES

Home Documents Committee Roster Technical Programming JOM Topics Contact Staff Liaison Doodle (Scheduling Tool)

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Electronic Packaging and Interconnection Materials Committee

JOM Topics

Past Topics

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