5th International Congress on 3D Materials Science
(3DMS 2020)

June 28–July 1, 2020 • Hyatt Regency Washington on Capitol Hill• Washington, D.C., USA

Technical Program

The following technical topics (as well as other related topics) will be covered during this congress:

• Methods for materials simulation and modelling
• 3D Data processing and reconstruction algorithms
• Process-microstructure-property relationships in 3D
• Materials dynamics in 3D
• New characterization methods
• Machine learning
• Other

The 5th International Congress on 3D Materials Science (3DMS 2020) seeks to provide the premier forum for presentations of current interest and significance to the three-dimensional characterization, visualization, quantitative analysis, modeling, and development of structure–property relationships of materials, as well as big data and machine learning issues associated with 3D materials science (3DMS). Additionally, this congress will provide an intimate environment for rich discussions and interactions among the key researchers in the world to not only assess the state-of-the-art within the various elements of 3DMS, but also to roadmap the key areas of future research. The congress will include plenary, keynote, and invited lectures as well as contributed presentations. The technical program will:

• Cover a range of topical areas representing the most critical and rapidly growing areas of 3D materials science
• Include oral presentations, interactive poster sessions, and panel discussions for maximum interaction
• Address state-of-the-art subtopics to roadmap key areas for future research in 3DMS

Update: A late-news poster session will highlight very recent developments. The late-news poster deadline is May 1, 2020. We welcome posters with the very latest news and novel preliminary results related to this fast-evolving field. Labels will denote late-news posters from others on display. Visit ProgramMaster to submit an abstract for the late-news poster session.

Plenary Speakers

Jaafar El-Awady
Johns Hopkins University, USA
Presentation Title: "Acoustic Emission Measurements of Damage Accumulation and Crack Initiation in Metals at the Micron-scale"

Satoshi Hata
Kyushu University, Japan
Presentation Title: "Toward Dynamic 3D Visualization of Dislocations by Electron Tomography"

Helena Van Swygenhoven
Paul Scherrer Institute & Swiss Federal Institute of Technology Lausanne, Switzerland
Presentation Title: "Operando and Insitu Synchrotron Experiments Following Microstructural Evolutions"

Invited Speakers

• Joel Bernier
  Lawrence Livermore National Laboratory, USA
• Vincent De Andrade
  Advanced Photon Source, USA
• Marc DeGraef
  Carnegie Mellon University, USA
• Kui Du
  Chinese Academy of Sciences, China
• Ulrich Lienert
  DESY, Germany
• Emmanuel Marquis
  University of Michigan, USA
• Dirk Mohr
  ETH Zurich, Switzerland
• Kelly Nygren
  Cornell High Energy Synchrotron Source, USA
• Reeju Pokharel
  Los Alamos National Laboratory, USA
• Michael Sangid
  Purdue University, USA
• Hemant Sharma
  Argonne National Laboratory, USA
• Kazuyuki Shimizu
  Kyushu University, Japan
• Katsuyo Thornton
  University of Michigan, USA
• Michael Uchic
  Air Force Research Laboratory, USA
• Masayuki Uesugi
  JASRI/SPring-8, Japan
• Tiqiao Xiao
  Chinese Academy of Sciences, China
• Hideyuki Yasuda
  Kyoto University, Japan
• Yubin Zhang
  Technical University of Denmark, Denmark