June 22-24 • Santa Barbara, California

SAMPLE ABSTRACTS View the presentation, "Effect of Carbonization Process Conditions on Surface Morphology of 3C-SiC Films Grown on Si Substrates" as a sample abstract and extended abstract.

EMC 2011: Organizing Committees
June 22-24, 2011 • University of California • Santa Barbara, CA

Energy Conversion and Storage Materials

This technical area is being organized by the following individuals:

• Photovoltaics: Organic and Hybrid
  David Janes, Purdue University
  Reuben Collins, Colorado School of Mines
  David Gunlach, National Institute of Standards and Technology
  Julia Hsu, Sandia National Laboratories
  Peter Dinolfo, Rensselaer Polytechnic Institute
  
• Highly Mismatched Dilute Alloys
  Doug Hall, University of Notre Dame
  Charles Tu, University of California – San Diego
  Rachel Goldman, University of Michigan
  Kin-Man Yu, Lawrence Berkeley National Laboratory
  Thomas Kuech, University of Wisconsin
  
• Next Generation Solar Cell Materials and Devices
  Mark Goorsky, University of California-Los Angeles
  Christian Wetzel, Rensselaer Polytechnic Institute
  Jerry Woodall, Purdue University
  Steve Ringel, Ohio State University
  Debdeep Jena, University of Notre Dame
  
• Thermoelectrics and Thermionics
  Tim Sands, Purdue University
  Pete Moran, Michigan Technical University
  Mayank Bulsara, Massachusetts Institute of Technology
  Joshua Zide, University of Delaware
  
• Ionic Conductors for Solid Oxide Fuel Cells and Batteries
  Pete Moran, Michigan Technical University
  Alec Talin, National Institute of Standards and Technology
  Jerry Woodall, Purdue University
  Eric Wachsma, University of Maryland

Issues for Wide Bandgap Materials

This technical area is being organized by the following individuals:

• Group III-Nitrides: Growth, Processing, Characterization, Theory and Devices
  Andrew Allerman, Sandia National Laboratory
  Russ Dupuis, Georgia Institute of Technology
  Mike Manfra, Purdue University
  Huili Grace Xing, University of Notre Dame
  Theeradetch Detchprohm, Rensselaer Polytechnic Institute
  Thomas Myers, Texas State University
  
• UV Detectors and Emitters: Materials and Devices
  Debdeep Jena, University of Notre Dame
  Jerry Woodall, Purdue University
  Michael Wraback, U.S. Army Research Laboratory
  
• Silicon Carbide: Growth, Processing, Characterization, Theory and Devices
  Robert Stahlbush, Naval Research Laboratory
  Mike Capano, Purdue University
  Brett Hull, Cree, Inc.
  Joshua Caldwell, Naval Research Laboratory
  Michael Dudley, State University of New York at Stony Brook
  
• Oxide Semiconductors: Growth, Doping, Defects, Nanostructures and Devices
  Len Brillson, Ohio State University
  Tom Jackson, Pennsylvania State University
  Jamie Phillips, University of Michigan
  John Conley, Oregon State University
  Yicheng Lu, Rutgers University
  Mike Gerhold, Army Research Laboratory
  
• Indium Nitride: Growth, Processing, Characterization, Theory and Devices
  Christian Wetzel, Rensselaer Polytechnic Institute
  Joel Ager, Lawrence Berkeley Laboratory
  Yasushi Nanishi, Ritsumeikan University
  Debdeep Jena, University of Notre Dame
  
• Point Defects, Doping and Extended Defects
  Christian Wetzel, Rensselaer Polytechnic Institute
  Andrew Armstrong, Sandia National Laboratory
  James Speck, University of California-Santa Barbara
  Jerry Woodall, Purdue University
  Steve Ringel, Ohio State University
  Eugene Fitzgerald, Massachusetts Institute of Technology

Nanoscale Science and Technology in Materials

This technical area is being organized by the following individuals:

• Graphene and Carbon Nanotubes
  Huili Grace Xing, University of Notre Dame
  Walt de Heer, Georgia Institute of Technology
  Randall Feenstra, Carnegie Mellon University
  Mike Spencer, Cornell University
  Avik Ghosh, University of Virginia
  Suneel Kodambaka, University of California-Los Angeles
  Randy Sanhu, Northrup Grumman Space Technology
• Nanotubes and Nanowires
  Joan Redwing, Pennsylvania State University
  William Wong, University of Waterloo
  Suzanne Mohney, Pennsylvania State University
  Kris Bertness, National Institute of Standards and Technology
  Raymond Tsui, Motorola Laboratories
  Cheng Yang, Purdue University
  
• Low-Dimensional Structures: Quantum Dots, Wires and Wells
  Jim Merz, University of Notre Dame
  Akio Sasaki, Kyoto University of Japan
  Ben Shanabrook, Naval Research Laboratory
  Diana Huffaker, University of California-Los Angeles
  Glenn Solomon, National Institute of Standards and Technology
  
• Nanoscale Characterization: Scanning Probes, Electron Microscopy and Other Techniques
  Ed Yu, University of Texas at Austin
  Lincoln Lauhon, Northwestern University
  Sarah Olsen, Newcastle University, UK
  Suneel Kodambaka, University of California, Los Angeles
  
• Molecular Electronics: Devices, Materials and Sensors
  David Janes, Purdue University
  Alec Talin, National Institute of Standards and Technology
  Theresa Mayer, Pennsylvania State University

Enabling Technologies

This technical area is being organized by the following individuals:

• Metamaterials
  Kitano Masao, University of Kyoto
  Laura Rea, Air Force Research Laboratories
  Jacob Khurgin, John Hopkins University
  Sasha Boltasseva, Purdue University
  
• Flexible and Printed Thin Film Electronics
  Tom Jackson, Pennsylvania State University
  William Wong, University of Waterloo
  Thomas Kuech, University of Wisconsin
  Oana Jurchescu, Wake Forest University
  
• Organic Thin Film and Crystalline Transistors: Devices, Materials and Processing
  Tom Jackson, Pennsylvania State University
  Alberto Salleo, Stanford University
  Michael Chabinyc, University of California-Santa Barbara
  David Gundlach, National Institute of Standards and Technology
  Oana Jurchescu, Wake Forest University
  
• Nano-Magnetic, Magnetic Memory and Spintronic Materials
  Ian Appelbaum, University of Maryland
  Michael Flatte, University of Iowa
  Xinyu Liu, University of Notre Dame
  Shriram Ramanathan, Harvard University
  Nitin Samarth, Pennsylvania State University
  Masaaki Tanaka, University of Tokyo
  
• Contacts to Semiconductor Epilayers, Nanowires, Nanotubes and Organic Films
  Suzanne Mohney, Pennsylvania State University
  Jerry Woodall, Purdue University
  Martin Allen, University of Canterbury
  Lisa Porter, Carnegie Mellon University
  Tae-Yeon Seong, Korea University
  
• Epitaxial Materials and Devices
  Archie Homes, University of Virginia
  Kurt Eyink, Air Force Research Laboratories
  Kei-May Lau, Hong Kong University of Science and Technology
  Alan Doolittle, Georgia Institute of Technology
  Steve Ringel, Ohio State University
  Christine Wang, MIT Lincoln Laboratory
  Amy Liu, IQE, Inc.
  Seth Bank, University of Texas-Austin
  Charles Lutz, Kopin Corporation
  Michael Tischler, OCIS Technology
• Narrow Bandgap Materials and Devices
  Bob Biefeld, Sandia National Laboratory
  Ralph Dawson, University of New Mexico
  Brian Bennett, Naval Research Laboratory
  Partha Dutta, Rensselaer Polytechnic Institute
  Ganesh Balakrishnan, University of New Mexico
  Suman Datta, Pennsylvania State University
  
• Nondestructive Testing and In Situ Monitoring and Control
  Mark Goorsky, University of California-Los Angeles
  Kurt Eyink, Air Force Research Laboratories
  
• Semiconductor Processing: Oxidation, Passivation, and Etching
  Suzanne Mohney, Pennsylvania State University
  Doug Hall, University of Notre Dame
  Maria Losurdo, CNR-IMIP
  
• Materials Integration: Wafer Bonding and Engineered Substrates
  Mark Goorsky, University of California-Los Angeles
  Maria Losurdo, CNR-IMIP
  Pete Moran, Michigan Technical University
  Cindy Colinge, Tyndall National Institute
  Eugene Fitzgerald, Massachusetts Institute of Technology
  Karl Hobart, Naval Research Laboratory
  James Lu, Rensselaer Polytechnic Institute
  
• Oxide Thin Film Integration: Alternative Dielectrics, Epitaxial Oxides, Multifunctional Oxides, Superlattices and Metal Gates
  Pat Lenahan, Pennsylvania State University
  John Conley, Oregon State University
  Evgeni Gusev, Qualcomm MEMS Technologies
  
• Si-Based Heterojunctions
  Sarah Olsen, Newcastle University, UK
  Eugene Fitzgerald, Massachusetts Institute of Technology
  Michael Tischler, OCIS Technology
  Ya-Hing Xie, University of California-Los Angeles
• Compound Semiconductor Growth on Si Substrates (Heteroepi on Si)
  Eugene Fitzgerald, Massachusetts Institute of Technology
  Steve Ringel, Ohio State University
  Kei-May Lau, Hong Kong University of Science and Technology
  Ralph Dawson, University of New Mexico
  Jerry Woodall, Purdue University
  

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