Date: Sunday, March 23 Time: 1:00 p.m. to 5:30 p.m. Location: MGM Grand Las Vegas Hotel & Casino Sponsored by: Electronic Packaging and Interconnection Materials Committee
This Lead-Free Solders and Interconnect Technology Workshop provides the latest development and research studies on interconnect materials and electronic packaging technologies. Due to the miniaturization and multi-functional trends for electronic packages, the key materials used in different levels of packaging have dramatically changed or experienced severe service conditions. 2.5D and 3D interposer related technology show a fast trend in the industry looking for more fundamental mechanisms to be explored. In addition to the 3D technology in multi-stacking packages and interconnects, new methodologies like additive manufacturing with embedded interconnects are new areas for further research and development. With these introductions of new technologies, researchers in these fields have agreed that fundamental studies are needed to go further from the materials perspective to improve the service capability of the new materials and assemblies. The workshop will both introduce the new technology trend and will provide and address deep-dive discussion topics for both industry and academia.
Participants will receive a post-event digital credential.
This workshop will be beneficial to both academic and industry audiences. It will benefit those working in the electronic industry related to electronic packaging and semiconductor manufacturing, as well as those working in the automobile, telecommunication, and military industries, which use electronic devices. Academic and research institutes conducting research on interconnects, thermal/mechanical reliability testing, and new material development (not only on solder or interconnect materials but also on thermal interface and structure materials) are included in the target audience.
Cisco
Tae-Kyu Lee
National Central University
Albert Wu
University of Queensland
Kazuhiro Nogita
Additional instructors to be announced
Courses and workshops are open exclusively to registrants for the TMS 2025 Annual Meeting & Exhibition and are included as part of the conference registration fee. If you wish to participate in one of the offered courses, please make your selection when you register for TMS2025. All courses are held on Sunday, March 23, so make your travel plans accordingly.
Register for TMS2025
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