Meeting Resources
5th International Congress on 3D Materials Science (3DMS 2021)

5th International Congress on 3D Materials Science
(3DMS 2021)

June 29–July 2, 2021 • Virtual Event

Final Program

Registration is now closed.

This virtual event took place June 29–July 2, 2021. The recorded content was available to registrants until July 31, 2021. Please join the e-mail list to receive updates about 3DMS and future meetings.

The 5th International Congress on 3D Materials Science (3DMS 2021) seeks to provide the premier forum for presentations of current interest and significance to the three-dimensional characterization, visualization, quantitative analysis, modeling, and development of structure–property relationships of materials, as well as big data and machine learning issues associated with 3D materials science.

"For me, the 3DMS congress series is outstanding and 'a must' to attend, as it is the cornerstone in building a new community within materials science. This community has grown significantly over the years, and it is enlightening that such a broad and cross-disciplinary 'team' has built up. Without the various skills, we would never have been able to move materials science to 3D."
– Dorte Juul Jensen, 3DMS 2021 chair

Thank You to Our Sponsors

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Plenary Speakers

Jaafar El-Awady
Johns Hopkins University, USA
Presentation Title: "Acoustic Emission Measurements of Damage Accumulation and Crack Initiation in Metals at the Micron-scale"
Satoshi Hata
Kyushu University, Japan
Presentation Title: "Toward Dynamic 3D Visualization of Dislocations by Electron Tomography"
Helena Van Swygenhoven
Paul Scherrer Institute & Swiss Federal Institute of Technology Lausanne, Switzerland
Presentation Title: "Operando and Insitu Synchrotron Experiments Following Microstructural Evolutions"

Learn more about the technical program.

Congress Sponsors and Organizers

This congress is sponsored by the TMS Structural Materials Division (SMD) and the Advanced Characterization, Testing, and Simulation Committee, and is being organized by the following committee of individuals:
Lead Organizer: Dorte Juul Jensen, Technical University of Denmark, Denmark
Programming Chair: Erica Lilleodden, Helmholtz-Zentrum Geesthacht, Germany
Additional Organizers: Scott Barnett, Northwestern University, USA
Keith Knipling, Naval Research Laboratory, USA
Matthew P. Miller, Cornell University, USA
Akira Taniyama, Nippon Steel, Japan
Hiroyuki Toda, Kyushu University, Japan
Lei Zhang, Chinese Academy of Sciences, China

For More Information

For more information about this meeting, please complete the meeting inquiry form or contact:

TMS Meeting Services
5700 Corporate Drive Suite 750
Pittsburgh, PA 15237
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Other Countries: 1-724-776-9000, ext. 241
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